# US 2018/0025964 A1 · Fluid-filled microchannels

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0025964 A1
- Document ID: US20180025964A1
- Status: Published application
- Kind: A1
- Application number: 15/216,969
- Filed: 2016-07-22
- Published: 2018-01-25
- Earliest claimed: 2016-07-22
- Assignees: Hewlett Packard Enterprise Development LP
- Applicants: Hewlett Packard Enterprise Development LP
- Inventors: Niru Kumari; Sergio Escobar-Vargas
- Web page: https://patentgrep.com/patent/US20180025964A1

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 70/69: Insulating materials thereof
- H10W 40/253: {Semiconductors}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

## Claims

### Claim 1

A method comprising:
etching a microchannel in a first layer of a die;
sealing the microchannel of the first layer with a second layer of the die, wherein the microchannel sealed by the first layer and the second layer is isolated such that the fluid is trapped within the microchannel; and
filling the microchannel with a fluid, wherein the microchannel causes the fluid to flow through the microchannel responsive to a temperature gradient created along the microchannel.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first layer comprises a silicon layer and the second layer comprises a silicon dioxide layer, and
wherein sealing the first layer comprises bonding the second layer to the first layer.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first layer and the second layer are of a same material.

### Claim 4 (depends on 1)

The method of claim 1, comprising:
embedding a piezo-electric pump within the microchannel.

### Claim 5 (depends on 3)

The method of claim 3, comprising: activating the pump, wherein activating the pump causes the fluid to flow.

### Claim 6 (depends on 1)

The method of claim 1, wherein the fluid comprises a dielectric fluid.

### Claim 7 (depends on 1)

The method of claim 1, wherein the microchannel has a serpentine layout.

### Claim 8 (depends on 1)

The method of claim 1, wherein the microchannel comprises a closed loop system that encloses the fluid.

### Claim 10

A device comprising:
a first layer of a die, the first layer comprising a microchannel filled with a fluid, wherein the microchannel causes the fluid to flow through the microchannel responsive to a temperature gradient created along the microchannel; and
a second layer of the die, wherein the second layer seals a top of the microchannel of the first layer, wherein the microchannel sealed by the second layer is isolated such that the fluid is trapped within the microchannel.

### Claim 11 (depends on 10)

The device of claim 10, wherein the device includes a piezo-eletric pump within the microchannel.

### Claim 12 (depends on 10)

The device of claim 10, wherein the microchannel has a serpentine layout.

### Claim 13 (depends on 10)

The device of claim 10, wherein the second layer comprises microelectronic devices.

### Claim 14 (depends on 13)

The device of claim 13, wherein the microchannel comprises a closed loop system, wherein the microchannel is not coupled to a pump such that a pump does not cause the fluid to flow.

### Claim 15 (depends on 10)

The device of claim 10, wherein the microchannel is partially filled with air.

### Claim 16 (depends on 10)

The device of claim 10, wherein the first layer comprises a silicon layer, and wherein the second layer comprises a silicon dioxide layer.

### Claim 17 (depends on 10)

The device of claim 10, wherein the first layer and the second layer comprise a silicon dioxide layer.

### Claim 18

A device comprising:
a first layer of a die, the first layer comprising a microchannel, wherein the microchannel is partially filled with a liquid and partially filled with air that creates a meniscus within the microchannel, and wherein the microchannel causes the meniscus to flow through the microchannel responsive to a temperature gradient created along the microchannel; and
a second layer of the die bonded to the first layer, wherein the second layer bonded to the first layer prevents the liquid and the air fluid from moving out of and into the microchannel.

### Claim 19 (depends on 18)

The device of claim 18, wherein the fluid comprises deionized water.

### Claim 20 (depends on 18)

The device of claim 18, wherein the first layer comprises a silicon layer and the second layer comprises a silicon dioxide layer.

### Claim 21 (depends on 18)

The device of claim 18, wherein the device includes a pump within the microchannel.

### Claim 22 (depends on 18)

The device of claim 18, wherein the pump is activated in response to a detection of an increased temperature of the die.