# US 2018/0025963 A1 · Method, system, and electronic assembly for thermal management

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- Number: US 2018/0025963 A1
- Document ID: US20180025963A1
- Status: Published application
- Kind: A1
- Application number: 15/214,284
- Filed: 2016-07-19
- Published: 2018-01-25
- Earliest claimed: 2016-07-19
- Assignees: GE Energy Power Conversion Technology Limited
- Applicants: GE Energy Power Conversion Technology Ltd
- Inventors: Zane Taylor Miller
- Web page: https://patentgrep.com/patent/US20180025963A1

## CPC

- H10W 40/43: by flowing gases, e.g. forced air cooling
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}
- H10W 90/00: Package configurations
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

There are provided methods, systems, and electronic assemblies for efficient thermal management in electronics applications. For example, there is provided an electronic assembly that includes a thermal management system that can include a heat sink having electronic components mounted thereon. The electronic components can be mounted on the heat sink in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.

## Claims

### Claim 1

An electronic assembly, comprising:
a thermal management system including:
a heat sink having a plurality of dies mounted thereon in a staggered pattern along
a centerline substantially perpendicular to a direction of flow of a coolant.

### Claim 2 (depends on 1)

The electronic assembly of claim 1, wherein the coolant is air.

### Claim 3 (depends on 1)

The electronic assembly of claim 1, wherein some of the dies of the plurality of dies form a bridge assembly.

### Claim 4 (depends on 3)

The electronic assembly of claim 3, wherein the bridge assembly includes a plurality of switches selected from the group consisting of insulated gate bipolar transistors (IGBTs) and metal-oxide semiconductor field-effect transistors (MOSFETs).

### Claim 5 (depends on 4)

The electronic assembly of claim 4, wherein the group includes power MOSFETs, silicon carbide MOSFETs, silicon carbide IGBTs, and Gallium Nitride MOSFETs.

### Claim 6 (depends on 3)

The electronic assembly of claim 3, wherein the bridge assembly includes a plurality of semiconductor switches.

### Claim 7 (depends on 1)

The electronic assembly of claim 1, wherein the pattern includes a first separation distance according to which a first set of dies are disposed along the centerline and a second separation distance according to which a second set of dies are disposed substantially perpendicular to the centerline.

### Claim 8 (depends on 7)

The electronic assembly of claim 7, wherein the first separation distance and second separation distance are substantially equal.

### Claim 9 (depends on 7)

The electronic assembly of claim 7, wherein the first separation distance and the second separation distance are substantially different.

### Claim 10 (depends on 7)

The electronic assembly of claim 7, wherein each of the first separation distance and the second separation distance are each selected so that heat dissipation areas of any two dies do not overlap.

### Claim 11

(canceled)

### Claim 12 (depends on 1)

The electronic assembly of claim 1, wherein the thermal management system is included in a power conversion module.

### Claim 13

An electronic assembly, comprising:
a thermal management system including:
a heat sink having a plurality of electronic components mounted thereon in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.

### Claim 14 (depends on 13)

The electronic assembly of claim 13, wherein the coolant is air.

### Claim 15

A method for use with an electronic assembly, comprising:
mounting a plurality of electronic components on a heat sink in a staggered pattern along a centerline of a heat sink, the centerline being in a direction substantially perpendicular to a flow direction of a coolant of the heat sink.

### Claim 16 (depends on 15)

The method of claim 15, wherein the plurality of electronic components include a plurality of semiconductor switches.

### Claim 17 (depends on 16)

The method of claim 16, wherein the plurality of switches form a semiconductor bridge assembly.

### Claim 18 (depends on 15)

The method of claim 15, wherein the mounting includes disposing a first set electronic components according to a first separation distance and a second set of electronic components according to a second separation distance.

### Claim 19 (depends on 18)

The method of claim 18, wherein the first separation distance and the second separation distance are substantially equal.

### Claim 20 (depends on 18)

The method of claim 18, wherein the first separation distance and the second separation distance are substantially different.