# US 2018/0025960 A1 · Circuit package

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- Number: US 2018/0025960 A1
- Document ID: US20180025960A1
- Status: Published application
- Kind: A1
- Application number: 15/546,846
- Filed: 2015-03-27
- Published: 2018-01-25
- Earliest claimed: 2015-03-27
- Assignees: Hewlett-Packard Development Company, L.P.
- Applicants: Hewlett-Packard Development Company, L.P.
- Inventors: Chien-Hua Chen; Michael W Cumbie
- Web page: https://patentgrep.com/patent/US20180025960A1

## CPC

- H10W 74/147: {the encapsulations being multilayered}
- B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- H10W 40/251: {Organics}
- H10W 72/0198: {batch processes}
- H10W 74/016: {using moulds}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body}
- H10W 74/473: {containing a filler}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.

## Claims

### Claim 1

A circuit package panel comprising
a front and back face,
a packaging of epoxy mold compounds, and
a circuit device in the packaging, wherein
the packaging comprises, parallel to the front face, at least one hybrid layer of a first epoxy mold compound and next to it a second epoxy mold compound of a different composition.

### Claim 2 (depends on 1)

The circuit package of claim 1 comprising an array of circuit devices.

### Claim 3 (depends on 1)

The circuit package of claim 1 wherein
the circuit device extends in the first compound, and,
the second compound surrounds the first compound.

### Claim 5 (depends on 4)

The circuit package of claim 4 wherein the first compound extends under the circuit device and under the second compound.

### Claim 6 (depends on 5)

The circuit package of claim 5 wherein the second compound has a higher CTE than the first compound.

### Claim 7 (depends on 1)

The circuit package of claim 1 wherein the first and second compounds have a different CTE (Coefficient of Thermal Expansion) and the circuit device has a lower CTE than the compounds

### Claim 8 (depends on 1)

The circuit package of claim 1 wherein the second compound has a lower weight percentage of fillers than the first compound.

### Claim 9 (depends on 1)

The circuit package of claim 1 wherein the second compound has finer fillers, on average, than the first compound.

### Claim 10 (depends on 1)

The circuit package of claim 1 wherein
the circuit device is a fluidic device comprising a fluid channel array, and
the second compound comprises fluid holes to deliver fluid to the circuit device.

### Claim 11 (depends on 10)

The circuit package of claim 10 wherein the circuit devices each comprise relatively thin slivers having nozzle arrays of at least 300 nozzles per inch and having a width:length ration of at least 1:25.

### Claim 12

A method of compression molding a circuit package, comprising
depositing on a carrier a first epoxy mold compound and a second epoxy mold compound each of a different composition,
heating the epoxy mold compounds,
providing a circuit device in the first epoxy mold compound, and
compressing the epoxy mold compounds so that both epoxy mold compounds extend in one hybrid layer.

### Claim 13 (depends on 12)

The method of claim 12 wherein the second epoxy mold compound is deposited at least partly next to the first epoxy mold compound.

### Claim 14 (depends on 12)

The method of claim 12 wherein the depositing comprises patterning the second compound with respect to the first compound.

### Claim 15

A circuit package, comprising
a packaging formed of a plurality of different epoxy mold compounds, the packaging having a front face; and
a circuit device disposed in the packaging near the front face;
said plurality of epoxy mold compounds comprising, parallel to the front face, at least one hybrid layer of
a bulk epoxy mold compound, and
a second epoxy mold compound of a different composition than the bulk epoxy mold compound, next to the bulk epoxy mold compound.