# US 2018/0025929 A1 · Systems and methods for sensing process parameters during semiconductor device fabrication > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025929 A1 - Document ID: US20180025929A1 - Status: Published application - Kind: A1 - Application number: 15/218,241 - Filed: 2016-07-25 - Published: 2018-01-25 - Earliest claimed: 2016-07-25 - Assignees: Globalfoundries Inc. - Applicants: Globalfoundries, Inc. - Inventors: Boyd Finlay; Mark Reath; Eric Warren - Web page: https://patentgrep.com/patent/US20180025929A1 ## CPC - H10P 72/0612: {Production flow monitoring, e.g. for increasing throughput} - G05B 19/418: Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] - G05B 19/4185: {characterised by the network communication} - G05B 2219/31162: Wireless lan - G05B 2219/45031: Manufacturing semiconductor wafers - Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract Semiconductor device fabrication systems and methods are provided. In an example, a semiconductor device fabrication system includes a semiconductor fabrication tool. Further, the semiconductor device fabrication system includes wireless sensors associated with the semiconductor fabrication tool. The wireless sensors measure process parameters of the fabrication tool and transmit wireless signals. The semiconductor device fabrication system also includes a sensor controller configured to identify the wireless sensors associated with the semiconductor fabrication tool and to receive the wireless signals from the wireless sensors. The semiconductor device fabrication system further includes a tool controller including a receiver for receiving data from the sensor controller. The tool controller is configured to sequentially assign system variable identifiers (SVID) to the data from the sensor controller, and to contextualize the data in data packets. ## Claims ### Claim 1 A semiconductor device fabrication system comprising: a semiconductor fabrication tool; integrated sensors fixed in and/or around the semiconductor fabrication tool and configured to measure selected process parameters of the semiconductor fabrication tool and to transmit selected signals; wireless sensors associated with the semiconductor fabrication tool, wherein the wireless sensors measure desired process parameters of the semiconductor fabrication tool, and wherein the wireless sensors transmit wireless signals; a sensor controller configured to identify the wireless sensors associated with the semiconductor fabrication tool, to receive the wireless signals from the wireless sensors, to receive selected signals from the integrated sensors, and to contextualize the wireless signals with the selected signals to form data; and a tool controller including a receiver for receiving the data from the sensor controller, wherein the tool controller is configured to sequentially assign system variable identifiers (SVID) to the data from the sensor controller, and to further contextualize the data in data packets. ### Claim 2 (depends on 1) The semiconductor device fabrication system of claim 1 wherein the tool controller is configured to control operation processes of parts of the semiconductor fabrication tool. ### Claim 3 (depends on 1) The semiconductor device fabrication system of claim 1 wherein, to further contextualize the data, the tool controller is configured to perform an analysis on measured values of the process parameters and to generate a control signal in response to the analysis, the control signal instructing the semiconductor fabrication tool to adjust a fabrication operation. ### Claim 4 (depends on 1) The semiconductor device fabrication system of claim 1 wherein the tool controller is configured to assign a same system variable identifier (SVID) to data from a same wireless sensor. ### Claim 5 (depends on 1) The semiconductor device fabrication system of claim 1 further comprising a control equipment interface coupled to the tool controller to receive the data packets from the tool controller and to compile metadata related to semiconductor fabrication tool performance. ### Claim 6 (depends on 5) The semiconductor device fabrication system of claim 5 further comprising a centralized server coupled to the control equipment interface to diagnose fabrication errors. ### Claim 7 (canceled) ### Claim 8 (depends on 1) The semiconductor device fabrication system of claim 1 wherein the selected process parameters of the semiconductor fabrication tool are different from the desired process parameters measured by the wireless sensors. ### Claim 9 (depends on 1) The semiconductor device fabrication system of claim 1 wherein a first integrated sensor measures a first process parameter of the semiconductor fabrication tool at a first location and wherein a first wireless sensor measures the first process parameter at a second location different from the first location. ### Claim 10 (canceled) ### Claim 11 A semiconductor device fabrication system comprising: a semiconductor fabrication tool having an integrated interface that measures a first process parameter of the semiconductor fabrication tool; a sensor controller configured to receive and identify a wireless signal associated with the semiconductor fabrication tool, to receive the first process parameter, and to form mixed data from the wireless signal and first process parameter; and a tool controller configured to receive data from the integrated interface and the sensor controller, to assign a unique system variable identifier (SVID) to data from the sensor controller, and to contextualize the data in data packets. ### Claim 12 (depends on 11) The semiconductor device fabrication system of claim 11 further comprising at least one wireless sensor associated with the semiconductor fabrication tool, wherein each respective wireless sensor measures an additional process parameter of the semiconductor fabrication tool, and wherein each respective wireless sensor transmits a respective wireless signal to the sensor controller. ### Claim 13 (depends on 12) The semiconductor device fabrication system of claim 12 wherein the tool controller is configured to assign a same system variable identifier (SVID) to data from a same wireless sensor. ### Claim 14 (depends on 12) The semiconductor device fabrication system of claim 12 further comprising a control equipment interface coupled to the tool controller to receive the data packets from the tool controller and to compile metadata related to semiconductor fabrication tool performance. ### Claim 15 (depends on 14) The semiconductor device fabrication system of claim 14 further comprising a centralized server coupled to the control equipment interface to diagnose fabrication errors. ### Claim 16 (depends on 12) The semiconductor device fabrication system of claim 12 wherein each additional process parameter of the semiconductor fabrication tool is different from the first process parameter. ### Claim 17 (depends on 12) The semiconductor device fabrication system of claim 12 wherein the integrated interface measures the first process parameter of the semiconductor fabrication tool at a first location and wherein a respective wireless sensor measures the additional process parameter at a second location different from the first location. ### Claim 18 (depends on 11) The semiconductor device fabrication system of claim 11 wherein the tool controller includes a wireless signal receiver configured to receive the data from the sensor controller. ### Claim 19 (depends on 11) The semiconductor device fabrication system of claim 11 wherein the integrated interface is a wired input/output interface. ### Claim 20 A method for fabricating a semiconductor device, the method comprising: providing a semiconductor fabrication tool having an integrated interface that measures a first process parameter of the semiconductor fabrication tool and having a tool controller configured to receive data from the integrated interface; coupling a sensor controller to the tool controller; mounting a wireless sensor to measure a second process parameter of the fabrication tool; measuring a first semiconductor fabrication process parameter of the semiconductor fabrication tool using the integrated interface of the fabrication tool; communicating a first signal from the integrated interface to the tool controller; measuring a second semiconductor fabrication process parameter of the fabrication tool using the wireless sensor that is mounted to the fabrication tool; communicating a second signal from the wireless sensor to the sensor controller; transmitting the second signal from the sensor controller to the tool controller; and contextualizing data from the first signal and data from the second signal in the tool controller.