# US 2018/0025927 A1 · Substrate liquid processing apparatus, substrate liquid processing method, and storage medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025927 A1 - Document ID: US20180025927A1 - Status: Published application - Kind: A1 - Application number: 15/649,757 - Filed: 2017-07-14 - Published: 2018-01-25 - Earliest claimed: 2016-07-22 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Hiroyuki Masutomi; Toshiyuki Shiokawa; Koji Tanaka; Takami Satoh - Web page: https://patentgrep.com/patent/US20180025927A1 ## CPC - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/0424: {using mainly spraying means, e.g. nozzles} - H10P 72/0426: {with the semiconductor substrates being dipped in baths or vessels} - H10P 72/0434: {mainly by convection} - H10P 72/13: {Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements} - G02F 1/1303: {Apparatus specially adapted to the manufacture of LCDs} - G02F 1/1333: Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) - H10D 84/0158: {the components including FinFETs} - H10D 84/038: {using silicon technology, e.g. SiGe} - H10P 50/283: {by chemical means} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates. ## Claims ### Claim 1 A substrate liquid processing apparatus comprising: a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid; a processing liquid supply pipe configured to supply the processing liquid into the processing bath; and a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid, wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, and each of the gas supply pipes has a plurality of ejection holes opened to one side, and ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner without overlapping each other, in a direction parallel to the circuit-formed surfaces of the substrates. ### Claim 2 (depends on 1) The substrate liquid processing apparatus of claim 1, wherein the plurality of substrates are arranged at a predetermined arrangement pitch, and the ejection holes of the gas supply pipes are formed at an arrangement pitch corresponding to n times (n is an integer of 2 or more) the arrangement pitch of the substrates. ### Claim 3 (depends on 2) The substrate liquid processing apparatus of claim 2, wherein the ejection holes of the gas supply pipes are arranged at intermediate positions between the respective substrates. ### Claim 4 (depends on 1) The substrate liquid processing apparatus of claim 1, wherein a flow direction of a gas flowing through one gas supply pipe is directed opposite to a flow direction of a gas flowing through another adjacent gas supply pipe. ### Claim 5 (depends on 1) The substrate liquid processing apparatus of claim 1, wherein flow rates of one gas supply pipe and another adjacent gas supply pipe are adjusted independently of each other. ### Claim 6 (depends on 5) The substrate liquid processing apparatus of claim 5, wherein the one gas supply pipe and the another adjacent gas supply pipe are divided into a plurality of regions from an upstream side to a downstream side, and a flow rate of each of the regions is independently adjusted. ### Claim 7 A substrate liquid processing method performed using a substrate liquid processing apparatus that includes: a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid; a processing liquid supply pipe configured to supply the processing liquid into the processing bath; and a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid, wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, and each of the gas supply pipes has a plurality of ejection holes opened to one side, and ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner without overlapping each other, in a direction parallel to the circuit-formed surfaces of the substrates, wherein the substrate liquid processing method comprises: supplying the gas into the processing liquid through the ejection holes from the one gas supply pipe and the other adjacent gas supply pipe; and forming bubbles rising between the substrates in the processing liquid. ### Claim 8 A non-transitory computer-readable storage medium storing a computer-executable program that, when executed, causes a computer to execute a substrate liquid processing method using a substrate liquid processing apparatus: wherein the substrate liquid processing apparatus includes: a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid; a processing liquid supply pipe configured to supply the processing liquid into the processing bath; and a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid, wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, and each of the gas supply pipes has a plurality of ejection holes opened to one side, and ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner without overlapping each other, in a direction parallel to the circuit-formed surfaces of the substrates, wherein the substrate liquid processing method comprises: supplying the gas into the processing liquid through the ejection holes from the one gas supply pipe and the other adjacent gas supply pipe; and forming bubbles rising between the substrates in the processing liquid.