# US 2018/0025925 A1 · Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025925 A1 - Document ID: US20180025925A1 - Status: Published application - Kind: A1 - Application number: 15/723,266 - Filed: 2017-10-03 - Published: 2018-01-25 - Earliest claimed: 2011-08-30 - Assignees: Evatec AG - Applicants: Evatec AG - Inventors: Juergen Kielwein; Bart Scholte Von Mast; Rogier Lodder - Web page: https://patentgrep.com/patent/US20180025925A1 ## CPC - H10P 72/0436: {mainly by radiation} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate. ## Claims ### Claim 1 1) A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising a base arrangement with an extended, essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface; a metal circular wafer carrier plate mounted centered with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended, essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended, essentially plane surface with respect to said base arrangement; a multitude of heater lamp tubes arranged in said heater compartment along said extended, essentially plane surface and along said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement; wherein said heater compartment is operated in vacuum atmosphere. ### Claim 2 (depends on 1) 2) The wafer holder and temperature conditioning arrangement of claim 1, comprising an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a maximum temperature of at least 800° C., averaged over said other surface. ### Claim 3 (depends on 1) 3) The wafer holder and temperature conditioning arrangement of claim 1, said multitude of heater lamp tubes consisting of a multitude of equal heater lamp tubes, mounted in said heater compartment equally oriented with respect to radial direction from said center to said circular rim surface. ### Claim 4 (depends on 3) 4) The wafer holder and temperature conditioning arrangement of claim 3, the length extent direction of said heater lamp tubes being angularly offset from said radial direction. ### Claim 5 (depends on 1) 5) The wafer holder and temperature conditioning arrangement of claim 1, the position of at least a part of said heater lamp tubes in said heater compartment being adjustable. ### Claim 6 (depends on 1) 6) The wafer holder and temperature conditioning arrangement of claim 1, comprising a gas outlet- and dispensing-arrangement trough and along said other surface of said metal circular wafer carrier plate. ### Claim 7 (depends on 1) 7) The wafer holder and temperature conditioning arrangement of claim 1, comprising a piping arrangement in said base arrangement conceived to flow a liquid herein. ### Claim 8 (depends on 1) 8) The wafer holder and temperature conditioning arrangement of claim 1, comprising a wafer retaining arrangement operationally coupled to said metal circular wafer carrier plate, wherein in particular said wafer retaining arrangement is a weight-ring dimensioned so as to reside on the periphery of a wafer to be processed said weight-ring being preferably conceived to be electrically connected to an electric bias source. ### Claim 9 (depends on 1) 9) The wafer holder and temperature conditioning arrangement of claim 1, said heater lamp tubes having a thickness extent filling said heater compartment between said extended essentially plane surface and said one surface of said metal circular wafer carrier plate without contacting the just addressed surfaces. ### Claim 10 (depends on 1) 10) The wafer holder and temperature conditioning arrangement of claim 1, said extended essentially plane surface and said protruding peripheral circular rim surface being heat reflector surfaces, being preferably high gloss polished. ### Claim 11 (depends on 1) 11) The wafer holder and temperature conditioning arrangement of claim 1, said metal circular wafer carrier plate being electrically isolated from said base arrangement and preferably conceived to be electrically connected to an electric biasing source. ### Claim 12 (depends on 1) 12) The wafer holder and temperature conditioning arrangement of claim 1, said wafer carrier plate being conceived for one of: a 100 mm diameter wafer, said multitude consisting of four 500 W halogen heater lamp tubes, a 150 mm diameter wafer, said multitude consisting of five 500 W halogen heater lamp tubes, a 200 mm diameter wafer, said multitude consisting of ten 250 W halogen heater lamp tubes. ### Claim 13 13) A method of manufacturing a wafer coated with a layer, comprising providing in a vacuum process coating chamber a wafer holder and temperature conditioning arrangement comprising: a base arrangement with an extended essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface, a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended essentially plane surface with respect to said base arrangement, a multitude of heater lamp tubes arranged in said heater compartment along said extended essentially plane surface and said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement, an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes so as to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a predetermined temperature, averaged over said other surface, depositing on said other surface of said metal circular wafer carrier plate a wafer to be coated; drivingly rotating said metal circular wafer carrier plate while operating said electric power control unit to heat up said wafer to at least 800° C. and operating said heater compartment in vacuum atmosphere; and depositing a layer on said wafer. ### Claim 14 (depends on 13) 14) The method of claim 13, comprising said layer being of lead zirconatetitanate (PZT) deposited preferably by cosputtering lead, zirconium and titanium. ### Claim 15 15) A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising a base arrangement with an extended, essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface; a metal circular wafer carrier plate mounted centered with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended, essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended, essentially plane surface with respect to said base arrangement; a multitude of heater lamp tubes arranged in said heater compartment along said extended, essentially plane surface and along said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement; wherein the surface of said base arrangement is a heat reflector. ### Claim 16 (depends on 15) 16) The wafer holder and temperature conditioning arrangement of claim 15, comprising an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a maximum temperature of at least 800° C., averaged over said other surface. ### Claim 17 (depends on 15) 17) The wafer holder and temperature conditioning arrangement of claim 15, said multitude of heater lamp tubes consisting of a multitude of equal heater lamp tubes, mounted in said heater compartment equally oriented with respect to radial direction from said center to said circular rim surface. ### Claim 18 (depends on 17) 18) The wafer holder and temperature conditioning arrangement of claim 17, the length extent direction of said heater lamp tubes being angularly offset from said radial direction. ### Claim 19 (depends on 15) 19) The wafer holder and temperature conditioning arrangement of claim 15, the position of at least a part of said heater lamp tubes in said heater compartment being adjustable. ### Claim 20 (depends on 15) 20) The wafer holder and temperature conditioning arrangement of claim 15, comprising a gas outlet- and dispensing-arrangement trough and along said other surface of said metal circular wafer carrier plate. ### Claim 21 (depends on 15) 21) The wafer holder and temperature conditioning arrangement of claim 15, comprising a piping arrangement in said base arrangement conceived to flow a liquid herein. ### Claim 22 (depends on 15) 22) The wafer holder and temperature conditioning arrangement of claim 15, comprising a wafer retaining arrangement operationally coupled to said metal circular wafer carrier plate, wherein in particular said wafer retaining arrangement is a weight-ring dimensioned so as to reside on the periphery of a wafer to be processed said weight-ring being preferably conceived to be electrically connected to an electric bias source. ### Claim 23 (depends on 15) 23) The wafer holder and temperature conditioning arrangement of claim 15, said heater lamp tubes having a thickness extent filling said heater compartment between said extended essentially plane surface and said one surface of said metal circular wafer carrier plate without contacting the just addressed surfaces. ### Claim 24 (depends on 15) 24) The wafer holder and temperature conditioning arrangement of claim 15, said extended essentially plane surface and said protruding peripheral circular rim surface being heat reflector surfaces, being preferably high gloss polished. ### Claim 25 (depends on 15) 25) The wafer holder and temperature conditioning arrangement of claim 15, said metal circular wafer carrier plate being electrically isolated from said base arrangement and preferably conceived to be electrically connected to an electric biasing source. ### Claim 26 (depends on 15) 26) The wafer holder and temperature conditioning arrangement of claim 15, said wafer carrier plate being conceived for one of: a 100 mm diameter wafer, said multitude consisting of four 500 W halogen heater lamp tubes, a 150 mm diameter wafer, said multitude consisting of five 500 W halogen heater lamp tubes, a 200 mm diameter wafer, said multitude consisting of ten 250 W halogen heater lamp tubes. ### Claim 27 27) A method of manufacturing a wafer coated with a layer, comprising providing in a vacuum process coating chamber a wafer holder and temperature conditioning arrangement comprising: a base arrangement with an extended essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface, a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended essentially plane surface with respect to said base arrangement, a multitude of heater lamp tubes arranged in said heater compartment along said extended essentially plane surface and said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement, wherein the surface of said base arrangement is a heat reflector, an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes so as to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a predetermined temperature, averaged over said other surface, depositing on said other surface of said metal circular wafer carrier plate a wafer to be coated; drivingly rotating said metal circular wafer carrier plate while operating said electric power control unit to heat up said wafer to at least 800° C.; and depositing a layer on said wafer. ### Claim 28 (depends on 27) 28) The method of claim 27, comprising said layer being of lead zirconatetitanate (PZT) deposited preferably by cosputtering lead, zirconium and titanium.