# US 2018/0025813 A1 · Organic conductive coating materials > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025813 A1 - Document ID: US20180025813A1 - Status: Published application - Kind: A1 - Application number: 15/214,103 - Filed: 2016-07-19 - Published: 2018-01-25 - Earliest claimed: 2016-07-19 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: BRANDON M. KOBILKA; JOSEPH KUCZYNSKI; JACOB T. PORTER; JASON T. WERTZ - Web page: https://patentgrep.com/patent/US20180025813A1 ## CPC - C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)} - C09D 7/63: organic - H01B 1/02: mainly consisting of metals or alloys - H01B 1/124: {Intrinsically conductive polymers} - C08K 5/18: with aromatically bound amino groups - C08K 5/3417: condensed with carbocyclic rings - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A process of forming a hydrophobic, conductive barrier on a metallic surface includes coating the metallic surface with a solution that includes an organic, conductive material. The organic, conductive material has a conductive group that includes a triphenylamine group or a carbazole group. The organic, conductive material also has a dithiocarbamate group to bind the organic, conductive material to the metallic surface. ## Claims ### Claim 1 A process of forming a hydrophobic, conductive barrier on a metallic surface, the process comprising: coating the metallic surface with a solution that includes an organic, conductive material, the organic, conductive material comprising: a conductive group including a triphenylamine group or a carbazole group; and a dithiocarbamate group to bind the organic, conductive material to the metallic surface. ### Claim 2 (depends on 1) The process of claim 1, further comprising forming the organic, conductive material. ### Claim 3 (depends on 2) The process of claim 2, wherein forming the organic, conductive material includes: forming a nitro-functionalized triphenylamine material; and forming a triphenylamine-dithiocarbamate conductive organic material from the nitro-functionalized triphenylamine material. ### Claim 4 (depends on 3) The process of claim 3, wherein the nitro-functionalized triphenylamine material is formed from an iodobenzene material that includes alkyl or alkoxy chains. ### Claim 5 (depends on 2) The process of claim 2, wherein forming the organic, conductive material includes: forming a nitro-functionalized carbazole material; and forming a carbazole-dithiocarbamate conductive organic material from the nitro-functionalized carbazole material. ### Claim 6 (depends on 5) The process of claim 5, wherein the nitro-functionalized carbazole material includes nitro-functionalized N-phenylcarbazole. ### Claim 7 An article of manufacture comprising: a metallic material; an organic, conductive material disposed on a surface of the metallic material, the organic, conductive material comprising: a conductive group including a triphenylamine group or a carbazole group; and a dithiocarbamate group to bind the organic, conductive material to the surface of the metallic material, wherein the organic, conductive material forms a hydrophobic, conductive barrier on the surface of the metallic material. ### Claim 8 (depends on 7) The article of manufacture of claim 7, wherein the surface of the metallic material includes a micro-porous or nano-porous metallic surface. ### Claim 9 (depends on 7) The article of manufacture of claim 7, wherein a solution of the organic, conductive material is coated onto the surface of the metallic material. ### Claim 10 (depends on 7) The article of manufacture of claim 7, wherein the metallic material includes a nickel material. ### Claim 11 (depends on 7) The article of manufacture of claim 7, wherein the surface of the metallic material includes a plurality of apertures, each aperture of the plurality of apertures having a size in a range of 5 micrometers to 10 micrometers. ### Claim 12 (depends on 7) The article of manufacture of claim 7, wherein the surface of the metallic material has a contact angle that is greater than 120°. ### Claim 13 (depends on 12) The article of manufacture of claim 12, wherein the surface of the metallic material has a contact angle of about 150°. ### Claim 14 (depends on 7) The article of manufacture of claim 7, wherein the surface of the metallic material is permeable to gaseous materials but not to aqueous materials. ### Claim 15 A process of forming an article of manufacture having a porous, hydrophobic metallic surface, the process comprising: forming a porous metallic material; and coating the porous metallic material with a solution that includes an organic, conductive material to form a hydrophobic, conductive barrier on a surface of the porous metallic material, the organic, conductive material comprising: a conductive group including a triphenylamine group or a carbazole group; and a dithiocarbamate group to bind the organic, conductive material to the surface of the porous metallic material. ### Claim 16 (depends on 15) The process of claim 15, wherein the porous metallic material includes a porous nickel material. ### Claim 17 (depends on 15) The process of claim 15, wherein the porous hydrophobic metallic surface of the article of manufacture includes a plurality of apertures, each aperture of the plurality of apertures having a size in a range of 5 micrometers to 10 micrometers. ### Claim 18 (depends on 15) The process of claim 15, wherein the porous hydrophobic metallic surface of the article of manufacture has a contact angle that is greater than 120°. ### Claim 19 (depends on 15) The process of claim 15, wherein the porous hydrophobic metallic surface of the article of manufacture is permeable to gaseous materials but not to aqueous materials. ### Claim 20 (depends on 15) The process of claim 15, wherein the porous hydrophobic metallic surface of the article of manufacture includes a micro-porous or nano-porous metallic surface.