# US 2018/0025744 A1 · Row bar and wafer for forming magnetic heads > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025744 A1 - Document ID: US20180025744A1 - Status: Published application - Kind: A1 - Application number: 15/653,788 - Filed: 2017-07-19 - Published: 2018-01-25 - Earliest claimed: 2016-07-19 - Assignees: SAE Magnetics (H.K.) Ltd. - Applicants: SAE Magnetics (H.K.) Ltd. - Inventors: Ryuji FUJII; Shi Xiong CHEN; Long Ping WANG; Zeng Hui ZHANG - Web page: https://patentgrep.com/patent/US20180025744A1 ## CPC - G11B 5/3103: {Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing} - G11B 5/10: Structure or manufacture of housings or shields for heads - G11B 5/1272: {Assembling or shaping of elements (G11B5/1278 takes precedence)} - G11B 5/3163: {Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers} - G11B 5/3169: {Working or finishing the interfacing surface of heads, e.g. lapping of heads} - G11B 5/3173: {Batch fabrication, i.e. producing a plurality of head structures in one batch} - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) ## Abstract A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement. ## Claims ### Claim 1 A row bar for forming magnetic heads, comprising a row of magnetic head forming portions each of which has a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head, a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head, a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during lapping process, wherein a conductive structure that is higher than surfaces of the first and the second electrical lapping guide pads is formed at peripheries of the first and the second electrical lapping guide pads respectively. ### Claim 2 (depends on 1) The row bar for forming magnetic heads according to claim 1, wherein the conductive structures are formed around the peripheries of the first and the second electrical lapping guide pads respectively. ### Claim 3 (depends on 1) The row bar for forming magnetic heads according to claim 1, wherein the conductive structures are arranged at two opposite sides of the first and the second electrical lapping guide pads. ### Claim 4 (depends on 1) The row bar for forming magnetic heads according to claim 1, wherein the conductive structures are shaped in a strip, and have a width in a range of 8 μm˜15 μm. ### Claim 5 (depends on 1) The row bar for forming magnetic heads according to claim 1, wherein the conductive structures have a thickness at a distance from the surface of the first and the second electrical lapping guide pads, with a range of 500 A˜1000 A. ### Claim 6 (depends on 1) The row bar for forming magnetic heads according to claim 1, wherein the conductive structures are made of titanium or tantalum. ### Claim 7 A wafer for forming magnetic heads, comprising multiple row bars each of which comprises a row of magnetic head forming portions, each magnetic head forming portion having a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head, a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head, a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during lapping process, wherein a conductive structure that is higher than surfaces of the first and the second electrical lapping guide pads is formed at peripheries of the first and the second electrical lapping guide pads respectively. ### Claim 8 (depends on 7) The wafer for forming magnetic heads according to claim 7, wherein the conductive structures are formed around the peripheries of the first and the second electrical lapping guide pads respectively. ### Claim 9 (depends on 7) The wafer for forming magnetic heads according to claim 7, wherein the conductive structures are arranged at two opposite sides of the first and the second electrical lapping guide pads. ### Claim 10 (depends on 7) The wafer for forming magnetic heads according to claim 7, wherein the conductive structures are shaped in a strip, and have a width in a range of 8 μm˜15 μm. ### Claim 11 (depends on 7) The wafer for forming magnetic heads according to claim 7, wherein the conductive structures have a thickness at a distance from the surfaces of the first and the second electrical lapping guide pads, with a range of 500 A˜1000 A. ### Claim 12 (depends on 7) The wafer for forming magnetic heads according to claim 7, wherein the conductive structures are made of titanium or tantalum.