# US 2018/0025209 A1 · Fingerprint identification apparatus

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- Number: US 2018/0025209 A1
- Document ID: US20180025209A1
- Status: Published application
- Kind: A1
- Application number: 15/643,953
- Filed: 2017-07-07
- Published: 2018-01-25
- Earliest claimed: 2016-07-25
- Assignees: Superc-Touch Corporation
- Applicants: Superc-Touch Corporation
- Inventors: Hsiang-Yu LEE; Shang CHIN; Ping-Tsun LIN
- Web page: https://patentgrep.com/patent/US20180025209A1

## CPC

- G06V 40/1365: {Matching; Classification}
- G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing}
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING

## Abstract

A fingerprint identification apparatus includes a substrate, a second electrode layer, and a first electrode layer. The first electrode layer includes parallel first electrodes, and at least parts of the first electrodes have openings or dents. The second electrode layer includes parallel second electrodes and the second electrodes cross with the first electrodes on the substrate, where the openings or the dents are defined at the cross points from projected view. The second electrode is applied with transmitting signal and the corresponding electric field lines are received by the first electrode. The electric field lines detouring the edges of the first electrodes, or detouring the openings (or the dents) have induction with the finger close to or touching the first electrodes. The number of the effective electric field lines and the effective mutual capacitance changes can be increased to enhance the fingerprint sensing accuracy.

## Claims

### Claim 1

A fingerprint identification apparatus, comprising:
a substrate;
a plurality of parallel first electrodes, at least part of the first electrodes having a plurality of openings or dents;
a plurality of parallel second electrodes;
wherein the first electrodes and the second electrodes are cross to each other from projected view and the openings or dents are defined at overlapped regions of the first electrodes and the second electrodes from projected view.

### Claim 2 (depends on 1)

The fingerprint identification apparatus in claim 1, further comprising an insulation layer between the first electrodes and the second electrodes to electrically isolate the first electrodes and the second electrodes.

### Claim 3 (depends on 1)

The fingerprint identification apparatus in claim 1, wherein the first electrodes are arranged on a side of the second electrodes toward user finger.

### Claim 4 (depends on 3)

The fingerprint identification apparatus in claim 3, further comprising a plurality of auxiliary transmitting electrodes, the auxiliary transmitting electrodes being in one by one relationship with the second electrodes and arranged on a side of the corresponding second electrode opposite to the user finger.

### Claim 5 (depends on 1)

The fingerprint identification apparatus in claim 1, further comprising a plurality of connection wires and a plurality of contacts, part of the connection wires and the contacts being corresponding to and electrically connected to the first electrodes or the second electrodes.

### Claim 6 (depends on 1)

The fingerprint identification apparatus in claim 1, further comprising a fingerprint sensing integrated circuit (IC) having a plurality of contacts, part of the contacts being electrically connected to the first electrodes and the second electrodes.

### Claim 7 (depends on 1)

The fingerprint identification apparatus in claim 1, wherein the substrate is a glass substrate, a ceramic substrate, a polymer substrate or a sapphire substrate.

### Claim 8 (depends on 1)

The fingerprint identification apparatus in claim 1, wherein the substrate is a protection cover of a display screen.

### Claim 9 (depends on 1)

The fingerprint identification apparatus in claim 1, wherein the first electrodes are substantially perpendicular to the second electrodes.

### Claim 10 (depends on 1)

The fingerprint identification apparatus in claim 1, wherein at least part of the second electrodes have a plurality of openings or a plurality of dents defined at the overlapped regions, wherein locations of the openings or dents of the second electrodes are complementary with locations of the openings or dents of the first electrodes.

### Claim 11 (depends on 6)

The fingerprint identification apparatus in claim 6, wherein the fingerprint sensing integrated circuit (IC) comprises at least one mutual-capacitance sensing circuit, the mutual-capacitance sensing circuit is configured to sequentially or randomly apply a transmitting signal to at least one of the first electrodes and sequentially or randomly receive a fingerprint sensing signal from at least one of the second electrodes.

### Claim 12 (depends on 6)

The fingerprint identification apparatus in claim 6, wherein the fingerprint sensing integrated circuit (IC) comprises at least one mutual-capacitance sensing circuit, the mutual-capacitance sensing circuit is configured to sequentially or randomly apply a transmitting signal to at least one of the second electrodes and sequentially or randomly receive a fingerprint sensing signal from at least one of the first electrodes.

### Claim 13 (depends on 4)

The fingerprint identification apparatus in claim 4, further comprising a fingerprint sensing integrated circuit (IC) having a plurality of contacts, part of the contacts being electrically connected to the first electrodes, the second electrodes and the auxiliary transmitting electrodes.

### Claim 14 (depends on 13)

The fingerprint identification apparatus in claim 13, wherein the fingerprint sensing IC comprises at least one mutual-capacitance sensing circuit, the mutual-capacitance sensing circuit is configured to sequentially or randomly apply a transmitting signal to at least one of the second electrodes, apply an auxiliary transmitting signal with the same phase as the transmitting signal to the corresponding auxiliary transmitting electrode and sequentially or randomly receive a fingerprint sensing signal from at least one of the first electrodes.

### Claim 15 (depends on 6)

The fingerprint identification apparatus in claim 6, wherein the fingerprint sensing IC is pressed on the substrate through anisotropic conductive film (ACF).

### Claim 16 (depends on 6)

The fingerprint identification apparatus in claim 6, wherein the fingerprint sensing IC is fingerprint sensing IC chip and soldered to the substrate through low-melting-temperature alloy material.

### Claim 17 (depends on 6)

The fingerprint identification apparatus in claim 6, wherein the fingerprint sensing IC is fingerprint sensing IC chip and arranged on a flexible circuit board, the flexible circuit board is pressed on or soldered to the substrate.

### Claim 18 (depends on 13)

The fingerprint identification apparatus in claim 13, wherein the fingerprint sensing IC is fingerprint sensing IC chip and pressed on the substrate through anisotropic conductive film (ACF).

### Claim 19 (depends on 13)

The fingerprint identification apparatus in claim 13, wherein the fingerprint sensing IC is fingerprint sensing IC chip and soldered to the substrate through low-melting-temperature alloy material.

### Claim 20 (depends on 13)

The fingerprint identification apparatus in claim 13, wherein the fingerprint sensing IC is fingerprint sensing IC chip and arranged on a flexible circuit board, the flexible circuit board is adhered to or soldered to the substrate.
