# US 2018/0025208 A1 · Electronic device with fingerprint identification function > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0025208 A1 - Document ID: US20180025208A1 - Status: Published application - Kind: A1 - Application number: 15/400,997 - Filed: 2017-01-07 - Published: 2018-01-25 - Earliest claimed: 2016-07-25 - Assignees: MiiCs & Partners (Shenzhen) Co., Ltd. - Applicants: MiiCs & Partners (Shenzhen) Co., Ltd. - Inventors: JUAN WANG - Web page: https://patentgrep.com/patent/US20180025208A1 ## CPC - G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing} - G06V 10/147: Details of sensors, e.g. sensor lenses (fingerprint or palmprint sensors G06V40/13; vascular sensors G06V40/145; eye sensors G06V40/19) - G06V 40/1365: {Matching; Classification} - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING ## Abstract An electronic device able to identify fingerprints ultrasonically includes a substrate, a fingerprint identification structure, and an adhesive layer. The fingerprint identification structure includes a thin film transistor (TFT) substrate and a flexible printed circuit (FPC). The FPC includes a first portion and a second portion. The first portion is located on a surface of the TFT substrate facing away from the substrate. The second portion is extended from an end of the first portion to be electrically connected to a surface of the TFT substrate facing the substrate. The second portion is separated from the adhesive layer. A space is defined between the second portion and the substrate. The adhesive layer is susceptible to deformation and decomposition from environmental conditions. ## Claims ### Claim 1 An electronic device with fingerprint identification function comprising: a substrate; a fingerprint identification structure comprising a thin film transistor (TFT) substrate and a flexible printed circuit (FPC), the fingerprint identification structure configured to identify fingerprint; and an adhesive layer located between the substrate and the fingerprint identification structure; wherein the FPC comprises a first portion and a second portion; the first portion is located on a surface of the TFT substrate facing away from the substrate; the second portion extends from an end of the first portion to be electrically connected to a surface of the TFT substrate facing the substrate; a space is defined between the second portion and the substrate; the second portion above the substrate extends towards the adhesive layer to be adjacent to and spaced apart from the adhesive layer. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein a surface of the TFT substrate facing towards and adjacent to the substrate defines a first region and a second region; the second portion is electrically connected to the second region; the adhesive layer is positioned on and pasted to the first region. ### Claim 3 (depends on 2) The electronic device of claim 2, wherein the adhesive layer comprises a first adhesive portion positioned on and pasted to the first region and a second adhesive portion spaced apart from the first adhesive portion; the second adhesive portion is positioned between the second portion and the substrate, wherein the second adhesive portion is positioned on and pasted to a surface of the second portion facing towards the substrate; the second adhesive portion protects a surface of the second portion facing towards the substrate from being effected by moisture. ### Claim 4 (depends on 2) The electronic device of claim 2, wherein the second adhesive portion is separated from the substrate and fills a portion of a space between the second portion and the substrate. ### Claim 5 (depends on 4) The electronic device of claim 4, wherein a hardness of the first adhesive portion is equal to a hardness of the second adhesive portion. ### Claim 6 (depends on 4) The electronic device of claim 4, wherein a hardness of the first adhesive portion is larger than to a hardness of the second adhesive portion. ### Claim 7 (depends on 3) The electronic device of claim 3, wherein the second adhesive portion attaches to the substrate, and a hardness of the first adhesive portion is larger than a hardness of the second adhesive portion. ### Claim 8 (depends on 7) The electronic device of claim 7, wherein the fingerprint structure further comprises a transmitting layer and a receiving layer; the transmitting layer and the receiving layer are located on opposite surfaces of the TFT substrate; the first adhesive portion attaches the receiving layer and the substrate together; the FPC is located on the transmitting layer. ### Claim 9 (depends on 4) The electronic device of claim 4, wherein the hardness of the second adhesive portion is less than 60 based on an ASTMD2240 standard. ### Claim 10 An electronic device with fingerprint identification function comprising: a substrate; a fingerprint identification structure with a thin film transistor (TFT) substrate and a flexible printed circuit (FPC), the fingerprint identification structure configured to identify fingerprint; and an adhesive layer located between the substrate and the fingerprint identification structure; wherein the adhesive layer comprises a first adhesive portion; a surface of the TFT substrate facing towards and adjacent to the substrate defines a first region and a second region; the FPC comprises a first portion and a second portion; the first portion is located on a surface of the TFT substrate facing away from the substrate; the second portion extends from an end of the first portion to be electrically connected to the second region; the first adhesive portion attaches the TFT substrate and the substrate together; the second portion is positioned on and separated from the first adhesive portion; the second adhesive portion protects a surface of the second portion facing towards the substrate from being effected by moisture. ### Claim 11 (depends on 10) The electronic device of claim 10, wherein the second adhesive portion is separated from the substrate and fills a portion of a space between the second portion and the substrate. ### Claim 12 (depends on 11) The electronic device of claim 11, wherein a hardness of the first adhesive portion is equal to a hardness of the second adhesive portion. ### Claim 13 (depends on 11) The electronic device of claim 11, wherein a hardness of the first adhesive portion is larger than to a hardness of the second adhesive portion the second adhesive portion connects with the substrate. ### Claim 14 (depends on 10) The electronic device of claim 10, wherein the second adhesive portion attaches to the substrate; a hardness of the first adhesive portion is larger than to a hardness of the second adhesive portion. ### Claim 15 (depends on 10) The electronic device of claim 10, wherein the hardness of the second adhesive portion is less than 60 based on an ASTMD2240 standard. ### Claim 16 (depends on 10) The electronic device of claim 10, wherein the fingerprint structure further comprises a transmitting layer and a receiving layer; the transmitting layer and the receiving layer are located on opposite surfaces of the TFT substrate; the first adhesive portion attaches the receiving layer and the substrate together; the FPC is located on the transmitting layer.