# US 2018/0024437 A1 · Edge exposure apparatus

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- Number: US 2018/0024437 A1
- Document ID: US20180024437A1
- Status: Published application
- Kind: A1
- Application number: 15/541,636
- Filed: 2015-01-28
- Published: 2018-01-25
- Earliest claimed: 2015-01-28
- Assignees: Mitsubishi Electric Corporation
- Applicants: Mitsubishi Electric Corporation
- Inventors: Naoyuki TAKEDA; Shoichi KUGA
- Web page: https://patentgrep.com/patent/US20180024437A1

## CPC

- G03F 7/70825: {Mounting of individual elements, e.g. mounts, holders or supports (workpiece or mask holders G03F7/707)}
- G03F 7/2028: {of an edge bead on wafers}
- G03F 7/7015: {Details of optical elements}
- G03F 7/70266: {Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction}
- G03F 7/70308: {Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift}
- G03F 7/70433: {Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors}
- G03F 7/708: {Construction of apparatus, e.g. environment aspects, hygiene aspects or materials}
- G03F 7/70808: {Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus}
- H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An edge exposure apparatus for exposure of an outer circumferential portion of a semiconductor substrate to light includes a light source provided to be able to emit light to the outer circumferential portion and a mirror having a reflection surface arranged to extend in a direction intersecting with an optical axis of light emitted from the light source. The mirror is provided between the outer circumferential portion and a center of the semiconductor substrate in a radial direction of the semiconductor substrate in exposure of the outer circumferential portion of the semiconductor substrate to light.

## Claims

### Claim 1

An edge exposure apparatus for exposure of an outer circumferential portion of a semiconductor substrate to light, the edge exposure apparatus comprising:
a light source provided to be able to emit light to the outer circumferential portion; and
a mirror having a reflection surface arranged to extend in a direction intersecting with an optical axis of the light emitted from the light source,
the mirror being provided between the outer circumferential portion and a center of the semiconductor substrate in a radial direction of the semiconductor substrate in exposure of the outer circumferential portion of the semiconductor substrate to light.

### Claim 2 (depends on 1)

The edge exposure apparatus according to claim 1, the edge exposure apparatus further comprising a detection portion which can detect a distance between the mirror and the semiconductor substrate.

### Claim 3 (depends on 2)

The edge exposure apparatus according to claim 2, the edge exposure apparatus further comprising a mirror support base which can support the mirror, wherein
the mirror support base has a mirror movable portion which can vary an angle of the reflection surface with respect to the optical axis of the light.

### Claim 4 (depends on 3)

The edge exposure apparatus according to claim 3, wherein
the detection portion is arranged flush with a lower surface of the mirror support base.

### Claim 5 (depends on 3)

The edge exposure apparatus according to claim 3, wherein
the detection portion is connected to the mirror support base.

### Claim 6 (depends on 3)

The edge exposure apparatus according to claim 3, wherein
the light source and the mirror support base are provided so as to be integrally movable with respect to the semiconductor substrate.

### Claim 7 (depends on 2)

The edge exposure apparatus according to claim 2, wherein
the detection portion includes a first sensor which can detect a distance between the mirror and an inner circumferential portion surrounded by the outer circumferential portion in the semiconductor substrate, in a direction of thickness of the semiconductor substrate.

### Claim 8 (depends on 2)

The edge exposure apparatus according to claim 2, wherein
the detection portion includes a second sensor which can detect a distance between the mirror and the outer circumferential portion in the radial direction of the semiconductor substrate.

### Claim 9 (depends on 1)

The edge exposure apparatus according to claim 1, the edge exposure apparatus further comprising a substrate support base rotatably supporting the semiconductor substrate.