# US 2018/0024303 A1 · Optical module

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- Number: US 2018/0024303 A1
- Document ID: US20180024303A1
- Status: Published application
- Kind: A1
- Application number: 15/546,415
- Filed: 2016-02-25
- Published: 2018-01-25
- Earliest claimed: 2015-03-02
- Assignees: Sumitomo Electric Industries, Ltd.
- Applicants: Sumitomo Electric Industries, Ltd.
- Inventors: Hiromi Nakanishi
- Web page: https://patentgrep.com/patent/US20180024303A1

## CPC

- G02B 6/424: {Mounting of the optical light guide}
- G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)}
- G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)}
- G02B 6/4215: {the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers (G02B6/4246 takes precedence)}
- G02B 6/4237: {Welding}
- G02B 6/4251: {Sealed packages (G02B6/4248 takes precedence)}
- G02B 27/0916: {Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers (coupling into light guides using intermediate optical elements G02B6/4204; details of lighting devices in general F21V)}
- G02B 27/0955: {Lenses (lenses per se G02B3/00)}
- H01S 5/02251: using optical fibres
- H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
- H01S 5/4093: {Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion}
- G02B 6/29362: {Serial cascade of filters or filtering operations, e.g. for a large number of channels}
- G02B 6/4257: {having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence)}
- G02B 6/4265: {of the Butterfly or dual inline package [DIP] type}
- G02B 6/4271: {with thermo electric cooling}
- G02B 6/4285: {Optical modules characterised by a connectorised pigtail}
- H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings
- H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches
- H01S 5/4012: {Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

An optical module includes a light-forming part; a protective member and including an output window and disposed so as to surround the light-forming part; an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; and an optical coupling component that is connected to the adapter and that light passing through the optical passage enters. The light-forming part includes semiconductor light-emitting devices and lenses configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting devices. The optical coupling component includes an optical component and a support member supporting the optical component. The support member and the adapter are connected together.

## Claims

### Claim 1

An optical module comprising:
a light-forming part configured to form light;
a protective member that includes an output window configured to transmit light from the light-forming part and that is disposed so as to surround the light-forming part;
an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; and
an optical coupling component that is connected to the adapter and that light passing through the optical passage enters,
wherein the light-forming part includes
a semiconductor light-emitting device, and
a lens configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting device,
wherein the optical coupling component includes
an optical component, and
a support member supporting the optical component, and
wherein the support member and the adapter are connected together.

### Claim 2 (depends on 1)

The optical module according to claim 1, wherein the protective member and the adapter are connected together by welding.

### Claim 3 (depends on 1)

The optical module according to claim 1, wherein the support member and the adapter are connected together by welding.

### Claim 4 (depends on 1)

The optical module according to claim 1, wherein the light-forming part is hermetically sealed with the protective member.

### Claim 5 (depends on 1)

The optical module according to claim 1, wherein the semiconductor light-emitting device is configured to emit infrared light.

### Claim 6 (depends on 1)

The optical module according to claim 1, wherein the light-forming part includes
a plurality of the semiconductor light-emitting devices,
a plurality of the lenses individually disposed so as to correspond to the plurality of semiconductor light-emitting devices, and
a filter configured to multiplex light from the plurality of semiconductor light-emitting devices.

### Claim 7 (depends on 6)

The optical module according to claim 6, wherein the plurality of semiconductor light-emitting devices include a semiconductor light-emitting device configured to emit red light, a semiconductor light-emitting device configured to emit green light, and a semiconductor light-emitting device configured to emit blue light.

### Claim 8 (depends on 1)

The optical module according to claim 1, wherein the semiconductor light-emitting device is a laser diode.