# US 2018/0024186 A1 · Method, device and system for measuring an electrical characteristic of a substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0024186 A1 - Document ID: US20180024186A1 - Status: Published application - Kind: A1 - Application number: 15/546,252 - Filed: 2016-01-19 - Published: 2018-01-25 - Earliest claimed: 2015-01-27 - Assignees: Soitec - Applicants: Soitec; Universite Catholique Du Louvain - Inventors: Cédric Malaquin; Jean-Pierre Raskin; Eric Desbonnets - Web page: https://patentgrep.com/patent/US20180024186A1 ## CPC - G01R 31/2822: {of microwave or radiofrequency circuits (of attenuation, gain, e.g. using network analyzers G01R27/28)} - G01R 29/0878: {Sensors; antennas; probes; detectors (wave guide measuring sections G01R1/24)} - G01R 29/12: Measuring electrostatic fields {or voltage-potential} - G01R 31/2648: {Characterising semiconductor materials (testing of materials or semi-finished products G01R31/2831; testing during manufacture H10P74/00)} - G01R 31/2831: {Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates (G01R31/318511 takes precedence; testing during manufacture H10P74/00)} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract The disclosure relates to a device for measuring an electrical characteristic of a substrate comprising a support made of a dielectric material having a bearing surface, the support comprising an electrical test structure having a contact surface flush with the bearing surface of the support, the bearing surface of the support and the contact surface of the electrical test structure being suitable for coming into close contact with a substrate. The measurement device also comprises at least one connection bump contact formed on another surface of the support and electrically linked to the electrical test structure. This disclosure also relates to a system for characterizing a substrate and a method for measuring a characteristic of a substrate employing the measurement device. ## Claims ### Claim 1 A measurement device for measuring an electrical characteristic of a substrate comprising: a support made of a dielectric material having a bearing surface, the support comprising an electrical test structure having a contact surface flush with the bearing surface of the support, the bearing surface of the support and the contact surface of the electrical test structure being suitable for coming into close contact with the substrate; at least one connection bump contact formed on another surface of the support and electrically linked to the electrical test structure. ### Claim 2 (depends on 1) The measurement device according to claim 1, wherein the measured electrical characteristic is static, and the electrical test structure comprises a block formed from an electrically conductive material. ### Claim 3 (depends on 1) The measurement device according to claim 1, wherein the measured electrical characteristic is a radiofrequency characteristic and the electrical test structure comprises at least one active or passive radiofrequency component. ### Claim 4 (depends on 3) The measurement device according to the claim 3, wherein the electrical test structure comprises at least one element chosen from the the group consisting of a transmission line, an inductor, a cross-talk characterizing component, a switch, an antenna, and a resonator. ### Claim 5 (depends on 1) The measurement device according to claim 1, wherein the support is rigid. ### Claim 6 (depends on 1) The measurement device according to claim 1, wherein the support is flexible. ### Claim 7 (depends on 1) The measurement device according to claim 1, wherein the dielectric material of the support is chosen from the group consisting of glass, alumina, a polymer, quartz, sapphire, and SiC. ### Claim 8 (depends on 1) The measurement device according to claim 1, wherein the connection bump contact is formed on the surface opposite the bearing surface of the support. ### Claim 9 (depends on 8) The measurement device according to claim 8, wherein the support comprises a via filled with an electrically conductive material to electrically link the electrical test structure and the connection bump contact. ### Claim 10 (depends on 1) A characterization system for characterizing a substrate, comprising: the a measurement device as recited in claim 1; and a plate for receiving the substrate recited in claim 1. ### Claim 11 (depends on 10) The characterization system according to claim 10, wherein the plate is configured to apply a voltage to the substrate. ### Claim 12 (depends on 10) The characterization system according to claim 10 further comprising means for relatively displacing the measurement device with respect to the plate. ### Claim 13 The characterization system according to 10, wherein the measurement device is secured to a holding member configured to place the support in close contact with the substrate. ### Claim 14 (depends on 10) The characterization system according to claim 10, further comprising an analysis computer connected to the connection bump contact of the measurement device. ### Claim 15 (depends on 14) The characterization system according to claim 14, wherein the analysis computer comprises an electrical signal source and an electrical signal analyzer. ### Claim 16 A measurement method for measuring an electrical characteristic of a substrate comprising the following steps: a) supplying a substrate having a main face; b) placing the main face of the substrate in close contact, by joining in a contact zone, with a contact surface of an electrical test structure included in a support made of a dielectric material, the contact surface of the electrical test structure being flush with a bearing surface of the support; c) propagating a signal in the electrical structure while maintaining the close contact; and d) measuring the signal propagated to determine the electrical characteristics of the substrate. ### Claim 17 (depends on 16) The measurement method according to claim 16, wherein placing in close contact comprises placing the support on the main face of the substrate in the contact zone, then applying a controlled holding force on the support during the propagation step c). ### Claim 18 (depends on 16) The measurement method according to claim 16, further comprising successively repeating steps b) through d). ### Claim 19 (depends on 18) The measurement method according to claim 18, wherein the repetition of steps b) through d) is applied in distinct contact zones of the main face of the substrate. ### Claim 20 (depends on 16) The measurement method according to claim 16, further comprising, after the propagation step c), a step e) of removal of the electrical test structure from the substrate.