# US 2018/0024162 A1 · Temperature-controlled module for electronic devices and testing apparatus provided with the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0024162 A1 - Document ID: US20180024162A1 - Status: Published application - Kind: A1 - Application number: 15/628,069 - Filed: 2017-06-20 - Published: 2018-01-25 - Earliest claimed: 2016-07-22 - Assignees: Chroma Ate Inc. - Applicants: Chroma Ate Inc. - Inventors: Chia-Hung CHIEN; Xin-Yi WU - Web page: https://patentgrep.com/patent/US20180024162A1 ## CPC - G01R 1/0458: {related to environmental aspects, e.g. temperature} - G01R 31/2877: {related to cooling} - G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)} - G05D 23/1919: {characterised by the type of controller} - G01R 1/44: Modifications of instruments for temperature compensation - G01R 31/2865: {Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863)} - G05D 23/24: the sensing element having a resistance varying with temperature, e.g. a thermistor - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - G05D: SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES ## Abstract A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided. ## Claims ### Claim 1 A temperature-controlled module of electronic device, comprising: a temperature-controlled tray, including at least one electronic-device holding cavity and a fluid chamber, the at least one electronic-device holding cavity being to contain at least one electronic device, the fluid chamber for receiving a cooling fluid being located inside the temperature-controlled tray; an upper board, furnished with at least one through hole, located aside to the temperature-controlled tray, a predetermined distance being formed between the upper board and the temperature-controlled tray, the at least one through hole being respective to the at least one electronic-device holding cavity of the temperature-controlled tray; and a dry-air supply device, providing a dry air to a space between the temperature-controlled tray and the upper board. ### Claim 2 (depends on 1) The temperature-controlled module of electronic device of claim 1, wherein the predetermined distance between the upper board and the temperature-controlled tray is greater than or equal to a height of an exposed portion of the at least one electronic device contained in the at least one electronic-device holding cavity. ### Claim 3 (depends on 1) The temperature-controlled module of electronic device of claim 1, wherein the temperature-controlled tray includes a base board and a holding board, the base board being provided with a fluid inlet path and a fluid route, the fluid inlet path being connected spatially with the fluid route and further with a cooling-fluid source, the at least one electronic-device holding cavity being formed on the holding board; the holding board being laid over the base board, the fluid chamber being constructed by the fluid inlet path and the fluid route. ### Claim 4 (depends on 3) The temperature-controlled module of electronic device of claim 3, further including a fluid-diffusing plate located between the fluid inlet path and the fluid route, the fluid-diffusing plate being a porous plate. ### Claim 5 (depends on 3) The temperature-controlled module of electronic device of claim 3, wherein the dry-air supply device further includes a dry-fluid source and an air-guide member, the dry-fluid source providing the dry air to the fluid inlet path, the air-guide member being located aside to the temperature-controlled tray and the upper board and connected spatially with the fluid route, the air-guide member leading at least one of the dry air and the cooling fluid to a space between the temperature-controlled tray and the upper board. ### Claim 6 (depends on 5) The temperature-controlled module of electronic device of claim 5, wherein the dry-air supply device further includes a micro-hole plate, the air-guide member further includes a guiding route, an air inlet of the guiding route is connected spatially with the fluid route, and the micro-hole plate is located at an air outlet of the guiding route. ### Claim 7 A temperature-controlled module of electronic device, comprising: a base board, including a fluid route connected spatially with a cooling-fluid source; an electronic-device carrier assembly, laid over the base board, including at least one electronic-device holding cavity and at least one through hole, a dry-air flowing space being formed between the at least one electronic-device holding cavity and the respective at least one through hole; and a dry-air supply device, supplying a dry air to the dry-air flowing space. ### Claim 8 (depends on 7) The temperature-controlled module of electronic device of claim 7, wherein the electronic-device carrier assembly includes a holding board and an upper board, the holding board being furnished with the at least one electronic-device holding cavity, the upper board being furnished with the at least one through hole, the upper board and the holding board being spaced by a predetermined distance so as to form the dry-air flowing space. ### Claim 9 (depends on 7) The temperature-controlled module of electronic device of claim 7, wherein the dry-air supply device further includes a dry-fluid source and an air-guide member, the dry-fluid source providing the dry air to the fluid route, the air-guide member located aside to the electronic-device carrier assembly and being connected spatially with the fluid route, the air-guide member being to lead at least one of the dry air and the cooling fluid to the dry-air flowing space. ### Claim 10 (depends on 9) The temperature-controlled module of electronic device of claim 9, wherein the dry-air supply device further includes a micro-hole plate, the air-guide member further includes a guiding route, an air inlet of the guiding route is connected spatially with the fluid route, and the micro-hole plate is located at an air outlet of the guiding route. ### Claim 11 A temperature-controlled module of electronic device provided with a testing apparatus, comprising: a material-inlet zone, being to accommodate an electronic device; a temperature-controlled zone, being to use a temperature-controlled module of the electronic device to lower a temperature of the electronic device to a specific temperature, the temperature-controlled module of electronic device including a temperature-controlled tray, an electronic-device carrier assembly and a dry-air supply device, the temperature-controlled tray being to receive a cooling fluid, the dry-air supply device being to provide a dry air to the electronic-device carrier assembly; a testing zone, being to test the electronic device that the temperature thereof has been lowered to a specific temperature; a material-outlet zone, being to the electronic device that the electronic device has been already examined (called as the examined electronic device); and at least one shipment device, being to convey the electronic device around the material-inlet zone, the temperature-controlled zone, the testing zone and the material-outlet zone. ### Claim 12 (depends on 11) The testing apparatus of claim 11, wherein the temperature-controlled tray includes a base board furnished with a fluid inlet path and a fluid route, the fluid inlet path being connected spatially with the fluid route so as to connect spatially a cooling-fluid source. ### Claim 13 (depends on 12) The testing apparatus of claim 12, further including a fluid-diffusing plate located between the fluid inlet path and the fluid route, the the fluid-diffusing plate being a porous plate. ### Claim 14 (depends on 12) The testing apparatus of claim 12, wherein the electronic-device carrier assembly further includes a holding board and an upper board, the holding board being furnished with the at least one electronic-device holding cavity, the upper board being furnished with the at least one through hole, the upper board and the holding board being spaced by a predetermined distance so as to form a dry-air flowing space. ### Claim 15 (depends on 14) The testing apparatus, of claim 14, wherein the dry-air supply device further includes a dry-fluid source and an air-guide member, the dry-fluid source providing the dry air to the fluid route, the air-guide member being located aside to the electronic-device carrier assembly and connected spatially with the fluid route, the air-guide member being to lead at least one of the dry air and the cooling fluid to the dry-air flowing space. ### Claim 16 (depends on 15) The testing apparatus of claim 15, wherein the dry-air supply device further includes a micro-hole plate, the air-guide member further includes a guiding route, an air inlet of the guiding route is connected spatially with the fluid route, and the micro-hole plate is located at an air outlet of the guiding route.