# US 2018/0023982 A1 · Sensor Module And Method For Producing A Sensor Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0023982 A1 - Document ID: US20180023982A1 - Status: Published application - Kind: A1 - Application number: 15/322,209 - Filed: 2015-06-24 - Published: 2018-01-25 - Earliest claimed: 2014-06-26 - Assignees: Conti Temic microelectronic GmbH - Applicants: Conti Temic Microelectronic GmbH - Inventors: JUERGEN HENNIGER; MATTHIAS KEUTEN; MATTHIAS WIECZOREK - Web page: https://patentgrep.com/patent/US20180023982A1 ## CPC - G01D 11/245: {Housings for sensors} - B29C 65/08: using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} - B29C 65/16: Laser beams - B29C 65/02: by heating, with or without pressure - B29C 65/1635: {at least passing through one of the parts to be joined, i.e. laser transmission welding} - B29C 66/543: {joining more than two hollow-preforms to form said hollow articles} - B29K 2995/0003: having particular electrical or magnetic properties, e.g. piezoelectric - B29K 2995/0026: Transparent - B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof - B29L 2031/752: {Measuring equipment} - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved. ## Claims ### Claim at position 1 1-14. (canceled) ### Claim 15 A sensor module, comprising: a sensor unit having a sensor surface and a base surface; a sensor cover covering said sensor surface and at least a portion of said base surface; and a separate main body, said sensor cover being connected to at least one of said base surface or said separate main body by way of a fused connection, and said separate main body being connected at least to said base surface of said sensor unit by way of the fused connection with a selectable relative position in relation to said sensor cover. ### Claim 16 (depends on 15) The sensor module according to claim 15, wherein at least one of said sensor cover, said main body or said sensor unit consists of a material that is laser-transparent, so that action of a laser beam suitable for welding on a respectively laser-transparent component is used to introduce heat in an interface between the respectively laser-transparent component and an adjoining component that is not laser-transparent. ### Claim 17 (depends on 15) The sensor module according to claim 15, wherein at least one of said base surface or said sensor cover has an at least partially peripheral projection, said partially peripheral projection running perpendicularly in relation to said base surface and being configured to fuse with a material of said sensor cover or said base surface to produce the fused connection. ### Claim 18 (depends on 15) The sensor module according to claim 15, wherein: said sensor unit is formed of a material that is laser-transparent; and said sensor cover and said separate main body are formed of a material that is not laser-transparent. ### Claim 19 (depends on 15) The sensor module according to claim 15, wherein: said sensor cover and said separate main body are formed of a material that is laser-transparent; and said sensor unit is formed of a material that is not laser-transparent. ### Claim 20 (depends on 15) The sensor module according to claim 15, wherein said separate main body being at a distance radially from said sensor cover, so that a gap is produced between said sensor cover and said separate main body, and said separate main body being disposed on a same side of said base surface as said sensor cover. ### Claim 21 (depends on 15) The sensor module according to claim 15, wherein said sensor cover is fused to said separate main body and said sensor unit is fused exclusively to said separate main body. ### Claim 22 (depends on 15) The sensor module according to claim 15, wherein the fused connection is produced by an ultrasonic welding method. ### Claim 23 A method for producing a sensor module, which comprises the steps of: providing a sensor unit having a sensor surface and a base surface; providing a sensor cover; providing a separate main body; disposing the sensor cover over the sensor unit in such a way that the sensor cover covers the sensor surface and at least a portion of the base surface; fusing the sensor cover to at least one of the base surface of the sensor unit or the separate main body; and disposing the separate main body on the base surface of the sensor unit and fusing the separate main body at least to the base surface of the sensor unit with a selectable relative position in relation to the sensor cover. ### Claim 24 (depends on 23) The method according to claim 23, wherein the fusing of the sensor cover to at least one of the base surface of the sensor unit or the separate main body further comprises fusing the sensor cover to the base surface. ### Claim 25 (depends on 24) The method according to claim 24, which further comprises disposing the separate main body on the base surface on a same side as the sensor cover and fusing the main body to the base surface. ### Claim 26 (depends on 23) The method according to claim 23, wherein the fusing of the separate main body at least to the base surface of the sensor unit further comprises fusing of the separate main body to the base surface of the sensor unit and to the sensor cover. ### Claim 27 (depends on 26) The method according to claim 26, which further comprises fusing the sensor cover and the sensor unit to two sides of the separate main body that are opposite one another. ### Claim 28 (depends on 23) The method according to claim 23, which further comprises carrying out the fusing via a laser welding method or by an ultrasonic welding method.