# US 2018/0022976 A1 · Adhesive Composition with High Frequency Characteristics and Application thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0022976 A1 - Document ID: US20180022976A1 - Status: Published application - Kind: A1 - Application number: 15/257,942 - Filed: 2016-09-07 - Published: 2018-01-25 - Earliest claimed: 2016-07-20 - Assignees: Microcosm Technology (Suzhou) Co., Ltd. - Applicants: Microcosm Technology (Suzhou) Co., Ltd. - Inventors: Donghai Du; Sih-Ci Jheng; Chao-Chin Chuang - Web page: https://patentgrep.com/patent/US20180022976A1 ## CPC - C09J 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors - C09J 11/04: inorganic - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract An adhesive composition with high frequency characteristics and the application thereof; wherein, the adhesive composition has a total weight of (A), (B) and (C) in 100 parts by weight, comprising: (A) 40-80 parts by weight of solvent-soluble polyimide; (B) 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; (C) 10-30 parts by weight of epoxy resin; and optionally comprising at least one of the following components: (D) flexibilizer; (E) flame retardant; (F) inorganic filler; (G) coupling agent; and (H) catalyst. The adhesive composition has the advantages of low dielectric constant, low dielectric loss, favorable heat resistance and low-temperature (<180° C.) adhesion. The adhesive composition can be used for preparing high-frequency protective membrane and high-frequency adhesive film. ## Claims ### Claim 1 An adhesive composition with high frequency characteristics, wherein, the adhesive composition has a total weight of the following components in 100 parts by weight, comprising: A: 40-80 parts by weight of solvent-soluble polyimide; B: 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; C: 10-30 parts by weight of epoxy resin; the adhesive composition also optionally comprises at least one of the following components: D: flexibilizer; E: flame retardant; F: inorganic filler; G: coupling agent; and H: catalyst. ### Claim 2 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the volume of addition of the flexibilizer does not exceed 25 parts by weight as the total weight of A, B and C is 100 parts by weight. ### Claim 3 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the volume of addition of the flame retardant does not exceed 30 parts by weight as the total weight of A, B and C is 100 parts by weight. ### Claim 4 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the volume of addition of the inorganic filler does not exceed 20 parts by weight as the total weight of A, B and C is 100 parts by weight. ### Claim 5 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the volume of addition of the coupling agent does not exceed 1 part by weight as the total weight of A, B and C is 100 parts by weight. ### Claim 6 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the volume of addition of the catalyst does not exceed 2 parts by weight as the total weight of A, B and C is 100 parts by weight. ### Claim 7 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the structure of the solvent-soluble polyimide is expressed by the following formula: wherein, R1 represents an organic group containing carboxyl; X represents a quadrivalent organic group containing at least two of fluorine functional group, aliphatic functional group and alicyclic functional group; n is an integer above 0. ### Claim 8 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the end group of the propenyl-modified polyphenylene oxide resin contains the organic group of hydroxyl, propenyl, vinyl, styryl or epoxy group; the average molecular weight is 1000-5000; the structure is expressed by the following formula: wherein, R2 is selected from the organic group containing hydroxyl, propenyl, vinyl, styryl or epoxy group; R3, R4, R5 and R6 are all selected from alkyl or phenyl with a carbon number below 6; n is an integer not larger than 300. ### Claim 9 (depends on 1) The adhesive composition with high frequency characteristics according to claim 1, wherein, the epoxy resin is selected from one or plurality of combinations of fluoride epoxy resin, dicyclopentadiene epoxy resin, biphenyl epoxy resin, naphthaline-containing epoxy resin and novolac epoxy resin. ### Claim 10 (depends on 1) The application of the adhesive composition with high frequency characteristics according to claim 1 in preparing high-frequency protective membrane and high-frequency adhesive film. ### Claim 11 (depends on 2) The application of the adhesive composition with high frequency characteristics according to claim 2 in preparing high-frequency protective membrane and high-frequency adhesive film. ### Claim 12 (depends on 3) The application of the adhesive composition with high frequency characteristics according to claim 3 in preparing high-frequency protective membrane and high-frequency adhesive film. ### Claim 13 (depends on 4) The application of the adhesive composition with high frequency characteristics according to claim 4 in preparing high-frequency protective membrane and high-frequency adhesive film. ### Claim 14 (depends on 5) The application of the adhesive composition with high frequency characteristics according to claim 5 in preparing high-frequency protective membrane and high-frequency adhesive film. ### Claim 15 (depends on 6) The application of the adhesive composition with high frequency characteristics according to claim 6 in preparing high-frequency protective membrane and high-frequency adhesive film.