# US 2018/0022079 A1 · Method and device for detaching a substrate from a substrate stack > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0022079 A1 - Document ID: US20180022079A1 - Status: Published application - Kind: A1 - Application number: 15/540,282 - Filed: 2015-01-14 - Published: 2018-01-25 - Earliest claimed: 2015-01-14 - Assignees: EV Group E. Thallner GmbH - Applicants: Ev Group E. Thallner GmbH - Inventors: Jurgen BURGGRAF - Web page: https://patentgrep.com/patent/US20180022079A1 ## CPC - B32B 43/006: {Delaminating} - C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers - C09J 5/06: involving heating of the applied adhesive - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer} - B32B 2310/0806: using electromagnetic radiation - C09J 2301/416: use of irradiation - C09J 2301/502: process for debonding adherents - C09J 2483/00: Presence of polysiloxane - H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method and device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate and a product substrate, as well as a bonding layer bonding the carrier substrate and the product substrate. The bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, and the adhesive strength is at least partially reduced by a beam of electromagnetic radiation directed at least predominantly on the bonding layer. ## Claims ### Claim at position 1 1-9. (canceled) ### Claim 10 A method for detaching a carrier substrate from a substrate stack that is comprised of the carrier substrate, a product substrate, and a bonding layer that bonds the carrier substrate and the product substrate, wherein the bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, said method comprising: directing a beam of electromagnetic radiation on the bonding layer to at least partially reduce said adhesive strength, wherein the electromagnetic radiation is a laser beam that is focused directly onto the bonding layer. ### Claim 11 (depends on 10) The method according to claim 10, wherein less than 50% of an amount of the electromagnetic radiation of the beam is absorbed by the carrier substrate and/or the product substrate. ### Claim 12 (depends on 10) The method according to claim 10, wherein the bonding layer comprises a material that is softened by the electromagnetic radiation. ### Claim 13 (depends on 12) The method according to claim 12, wherein the material of the bonding layer is selected from one of the following: silicones, and/or plastics. ### Claim 14 (depends on 13) The method according to claim 13, wherein the plastics are thermoplastics, and/or thermosetting plastics, and/or elastomers. ### Claim 15 (depends on 13) The method according to claim 13, wherein the material of the bonding layer is mixed with at least one additive. ### Claim 16 (depends on 10) The method according to claim 10, wherein the adhesive strength of the bonding layer is constituted so as to act at least predominantly in a peripheral edge region of the substrate stack. ### Claim 17 (depends on 10) The method according to claim 10, wherein the method includes directing the beam by means of optical elements onto the bonding layer, wherein the optical elements are arranged between a source of the beam and of the bonding layer. ### Claim 18 (depends on 10) The method according to claim 10, wherein the method includes orienting the beam towards the bonding layer such that an angle of inclination β between a radiation axis of the beam and an adhesive layer plane K of the bonding layer is less than 45°. ### Claim 19 (depends on 10) The method according to claim 10, wherein the method further comprises focusing and/or concentrating the directed beam. ### Claim 20 (depends on 19) The method according to claim 19, wherein the directed beam is focused and/or concentrated by at least one optical element. ### Claim 21 (depends on 10) The method according to claim 10, wherein the method further comprises directing the beam on a peripheral edge region of the substrate stack by a relative movement between the substrate stack and the beam or a source generating the beam. ### Claim 22 (depends on 21) The method according to claim 21, wherein the relative movement is a rotation. ### Claim 23 A device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate, a product substrate, and a bonding layer that bonds the carrier substrate and the product substrate, wherein the bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, the device comprising: a source for emitting a beam of electromagnetic radiation, the beam of electromagnetic radiation being a laser beam, wherein the adhesive strength is at least partially reduced by directing the laser beam on the bonding layer; and a focusing device for focusing the laser beam directly on the bonding layer.