# US 2018/0022013 A1 · Method of manufacturing display device and apparatus for manufacturing display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0022013 A1 - Document ID: US20180022013A1 - Status: Published application - Kind: A1 - Application number: 15/649,124 - Filed: 2017-07-13 - Published: 2018-01-25 - Earliest claimed: 2016-07-22 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Myung Gil CHOI; Jung Min LEE; Sang Moo LEE; Sae Sam JANG - Web page: https://patentgrep.com/patent/US20180022013A1 ## CPC - B29C 53/36: Bending and joining, e.g. for making hollow articles (B29C53/56 takes precedence) - B32B 37/12: characterised by using adhesives - B32B 37/14: characterised by the properties of the layers - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - B29L 2031/3425: {Printed circuits} - B29L 2031/3437: {Cellular phones} - B29L 2031/3475: {Displays, monitors, TV-sets, computer screens} - B32B 37/18: involving the assembly of discrete sheets or panels only - B32B 38/1866: {conforming the layers or laminate to a convex or concave profile} - B32B 2457/08: PCBs, i.e. printed circuit boards - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/055: Folded back on itself - H05K 2201/056: Folded around rigid support or component - H05K 2201/10128: Display - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member. ## Claims ### Claim 1 A method of manufacturing a display device, the method comprising: bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object, the first and second film members of the processing object being laminated on each other. ### Claim 2 (depends on 1) The method of claim 1, further comprising placing the processing object on a stage. ### Claim 3 (depends on 2) The method of claim 2, further comprising measuring a force applied to the stage when the first film member contacts the second film member. ### Claim 4 (depends on 2) The method of claim 2, wherein a cylinder is at one side of the stage and a rod extends between the cylinder and the stage, and wherein the rod moves into the cylinder to induce movement of the stage when the first film member contacts with the second film member during the bending. ### Claim 5 (depends on 2) The method of claim 2, wherein the bending comprises lowering one end of the stage by pivoting the stage. ### Claim 6 (depends on 1) The method of claim 1, wherein the bending comprises: bringing a bending head into contact with the first film member; and bending the first film member to surround the part of the outer side of the bending area of the second film member while the bending head is fixed to the first film member. ### Claim 7 (depends on 1) The method of claim 1, wherein the bending comprises: bending the first film member to surround the part of the outer side of the bending area of the second film member while a bending head comprising a first finger and a second finger is fixed to the first film member; and bringing a pressing member into contact with the first film member and detaching the bending head from the first film member. ### Claim 8 (depends on 1) The method of claim 1, wherein the bending comprises: bending the first film member such that an angle formed by an extension line of the first film member and a virtual horizontal line is a right angle; bringing a bending guide into contact with the first film member; and allowing the bending head to bend the first film member while the bending guide is in contact with the first film member. ### Claim 9 (depends on 1) The method of claim 1, wherein the bending comprises: bending the first film member such that an angle formed by an extension line of the first film member and a virtual horizontal line is a right angle while a front bending head is in contact with the one side the first film member; detaching the first bending head from the first film member and bringing a back bending head into contact with another side of the first film member; and bending the first film member while the back bending head is fixed to the first film member. ### Claim 10 (depends on 1) The method of claim 1, wherein the film member comprises a first panel and a first flexible printed circuit board connected with the first panel, and wherein the second film member comprises a second panel and a second flexible printed circuit board connected with the second panel. ### Claim 11 (depends on 10) The method of claim 10, wherein the second panel has the bending area, and wherein the bending comprises bending the first flexible printed circuit board such that the part of the one side of the first flexible printed circuit board surrounds the part of the outer side of the bending area of the second panel while the bending head is fixed to the first flexile printed circuit board. ### Claim 12 (depends on 11) The method of claim 11, wherein the bending comprises: attaching an auxiliary tape to the first flexible printed circuit board; and bending the first flexible printed circuit board such that the part of the one side of the first flexible printed circuit board surrounds the part of the outer side of the bending area of the second panel while the bending head is in contact with the first flexile printed circuit board. ### Claim 13 (depends on 10) The method of claim 10, wherein the first flexible printed circuit board comprises a plurality of contact hands, and each of the contact hands is connected with the first panel. ### Claim 14 (depends on 13) The method of claim 13, wherein the processing object further comprises a first adhesive layer and a second adhesive layer, and wherein the first adhesive layer, the first film member, the second adhesive layer, and the second film member are sequentially laminated. ### Claim 15 (depends on 14) The method of claim 14, wherein an end of the first adhesive layer is outside of an end of the second adhesive layer. ### Claim 16 (depends on 14) The method of claim 14, wherein an end of the second adhesive layer is outside of an end of the first adhesive layer. ### Claim 17 (depends on 14) The method of claim 14, further comprising arranging a first support between the first film member and the bending area of the second film member. ### Claim 18 (depends on 17) The method of claim 17, further comprising arranging a second support maintain the bent shape of the first film member after the bending. ### Claim 19 (depends on 1) The method of claim 1, wherein a plurality of electronic elements are on the first film member. ### Claim 20 (depends on 1) The method of claim 1, further comprising measuring a gap between the first film member and the second film member after the bending. ### Claim 21 (depends on 1) The method of claim 1, further comprising checking an alignment of the first film member and the second film member.