# US 2018/0021889 A1 · Method for manufacturing wavelength conversion member having depressed portion and light-emitting device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0021889 A1 - Document ID: US20180021889A1 - Status: Published application - Kind: A1 - Application number: 15/648,780 - Filed: 2017-07-13 - Published: 2018-01-25 - Earliest claimed: 2016-07-22 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Naoki EBOSHI; Hiroaki YUTO - Web page: https://patentgrep.com/patent/US20180021889A1 ## CPC - B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less} - B23K 26/083: {Devices involving movement of the workpiece in at least one axial direction} - B23K 26/359: by providing a line or line pattern, e.g. a dotted break initiation line - B23K 26/402: involving non-metallic material, e.g. isolators - F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer - F21K 9/90: Methods of manufacture - B23K 2101/36: Electric or electronic devices - B23K 2103/52: {Ceramics} - F21Y 2115/30: Semiconductor lasers - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A wavelength conversion member manufacturing method includes providing a wavelength conversion member having an upper surface, and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above. The forming of the at least one depressed portion includes performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the set of scanning includes performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, and the performing of the scanning includes applying the pulsed laser beam at a fixed processing depth. ## Claims ### Claim 1 A wavelength conversion member manufacturing method comprising: providing a wavelength conversion member having an upper surface, the wavelength conversion member including a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above, the forming of the at least one depressed portion including performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the performing of the set of the scanning including performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, the performing of the scanning including applying the pulsed laser beam at a fixed processing depth. ### Claim 2 (depends on 1) The wavelength conversion member manufacturing method according to claim 1, wherein the forming of the at least one depressed portion includes performing the set of scanning more than once from an upper processing depth to a lower processing depth. ### Claim 3 (depends on 1) The wavelength conversion member manufacturing method according to claim 1, wherein the forming of the at least one depressed portion includes performing the set of the scanning more than once such that the number of times of the scanning in each time of the set of scanning decreases as a distance from the upper surface increases. ### Claim 4 (depends on 1) The wavelength conversion member manufacturing method according to claim 1, wherein the applying of the pulsed laser beam includes applying the pulsed laser beam at a pulse width of 100 fs to 10,000 fs. ### Claim 5 (depends on 4) The wavelength conversion member manufacturing method according to claim 4, wherein the applying of the pulsed laser beam includes applying the pulsed laser beam at an output of 100 mW or less. ### Claim 6 (depends on 1) The wavelength conversion member manufacturing method according to claim 1, wherein the forming of the at least one depressed portion includes forming a plurality of depressed portions including the at least one depressed portion. ### Claim 7 (depends on 1) A method for manufacturing a light-emitting device, the method comprising: fixing the wavelength conversion member obtained by the wavelength conversion member manufacturing method according to claim 1, and a laser light source configured to emit first light by which the phosphor portion in the wavelength conversion member is excited to emit second light, in a positional relation in which the at least one depressed portion is irradiated with the first light. ### Claim 8 (depends on 7) The method for manufacturing the light-emitting device according to claim 7, wherein the inclined surface of each of the at least one depressed portion has a first surface that is inclined with respect to the upper surface and is configured to regularly reflect light directly applied along an optical axis of the first light upward. ### Claim 9 A wavelength conversion member manufacturing method comprising: providing the wavelength conversion member having an upper surface, the wavelength conversion member includes a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength member, at least one depressed portion each having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above more than once to form a plurality of continuous machining marks at different processing depths, or to form a plurality of continuous sets of machining marks at different processing depths, each of the continuous sets of the machining marks having a plurality of continuous machining marks at a fixed processing depth. ### Claim 10 (depends on 9) The wavelength conversion member manufacturing method according to claim 9, wherein the forming of the at least one depressed portion includes forming a plurality of depressed portions including the at least one depressed portion. ### Claim 11 (depends on 9) A method for manufacturing a light-emitting device, the method comprising: fixing the wavelength conversion member obtained by the wavelength conversion member manufacturing method according to claim 9, and a laser light source configured to emit first light by which the phosphor portion in the wavelength conversion member is excited to emit second light, in a positional relation in which the at least one depressed portion is irradiated with the first light. ### Claim 12 (depends on 11) The method for manufacturing the light-emitting device according to claim 11, wherein the inclined surface of the at least depressed portion has a first surface that is inclined with respect to the upper surface and is configured to regularly reflect light directly applied along an optical axis of the first light upward.