# US 2018/0021806 A1 · Thermal processing device, substrate processing apparatus and thermal processing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0021806 A1 - Document ID: US20180021806A1 - Status: Published application - Kind: A1 - Application number: 15/658,017 - Filed: 2017-07-24 - Published: 2018-01-25 - Earliest claimed: 2016-07-25 - Assignees: SCREEN Holdings Co., Ltd. - Applicants: SCREEN Holdings Co., Ltd. - Inventors: Yukihiko INAGAKI - Web page: https://patentgrep.com/patent/US20180021806A1 ## CPC - B05D 3/0254: {After-treatment} - B05D 1/005: {Spin coating} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/3306: {Horizontal transfer of a single workpiece} - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A thermal processing device includes a waiting section, a heating section and a transport mechanism. The waiting section includes a plurality of support pins. The transport mechanism includes a transport arm for holding a substrate and transports the substrate between the waiting section and the heating section by moving the transport arm. The transport arm has a plurality of regions and a plurality of cooling water passages for respectively cooling the plurality of regions are provided in the transport arm. ## Claims ### Claim 1 A thermal processing device comprising: a heating section in which heating processing is performed on a substrate; a waiting section that includes a supporter for supporting the substrate; and a transporter that includes a holder for holding the substrate and transports the substrate between the waiting section and the heating section by moving the holder, wherein the holder has a plurality of regions, and a plurality of cooling portions for respectively cooling the plurality of regions are provided in the holder. ### Claim 2 (depends on 1) The thermal processing device according to claim 1, wherein the plurality of cooling portions respectively have different cooling capacity such that variations in in-plane temperature of the substrate that is heated in the heating section and then held by the holder are equal to or less than a predetermined allowable value. ### Claim 3 (depends on 1) The thermal processing device according to claim 1, wherein the holder has a holding surface facing one surface of the substrate and having the plurality of regions, and the plurality of cooling portions are provided to respectively overlap with the plurality of regions in the holder. ### Claim 4 (depends on 1) The thermal processing device according to claim 1, wherein the plurality of regions include first and second regions, an amount of heat received by the first region in the heating section is smaller than an amount of heat received by the second region in the heating section, and the plurality of cooling portions include first and second cooling portions provided to respectively overlap with the first and second regions, and the second cooling portion has cooling capacity higher than cooling capacity of the first cooling portion. ### Claim 5 (depends on 4) The thermal processing device according to claim 4, wherein the holder has an opening through which heat in the heating section can pass, and the second region at least partially surrounds the opening. ### Claim 6 (depends on 5) The thermal processing device according to claim 5, wherein the supporter in the waiting section includes a plurality of first support members that support a lower surface of the substrate and are movable in an up-and-down direction, the heating section includes a heating plate having a heating surface, and a plurality of second support members that support the lower surface of the substrate and are movable in the up-and-down direction to move the substrate between a position above the heating plate and the heating surface of the heating plate, the plurality of first support members are provided to be insertable into the opening when the holder is positioned in the waiting section, and the plurality of second support members are provided to be insertable into the opening when the holder is positioned above the heating surface of the heating plate. ### Claim 7 (depends on 6) The thermal processing device according to claim 6, wherein the holder has an outer periphery corresponding to part of an outer periphery of the substrate, the opening has one or a plurality of slits that extend inward of the holder from the outer periphery of the holder, and the second region extends along the one or plurality of slits. ### Claim 8 (depends on 7) The thermal processing device according to claim 7, wherein the waiting section and the heating section are arranged in one direction, the holder is moved in the one direction between a position above the plurality of first support members in the waiting section and a position above the heating plate, and the one or plurality of slits extend in parallel with the one direction, the holder is movable in the one direction with the plurality of first support members inserted into the one or plurality of slits, and the holder is movable in the one direction with the plurality of second support members inserted into the one or plurality of slits. ### Claim 9 (depends on 1) The thermal processing device according to claim 1, wherein the plurality of cooling portions are a plurality of passages provided independently from one another in the holder, and cooling liquids having different temperatures are supplied to the plurality of passages. ### Claim 10 (depends on 1) The thermal processing device according to claim 1, wherein the plurality of cooling portions are a plurality of heat pipes provided independently from one another in the holder, and the plurality of heat pipes in the holder respectively have different temperatures. ### Claim 11 (depends on 1) A substrate processing apparatus that is arranged to be adjacent to an exposer, comprising: a coating device that coats a substrate with a photosensitive film; the thermal processing device according to claim 1 that performs thermal processing on the substrate; and a transport device that transports the substrate among the coating device, the exposer and the thermal processing device. ### Claim 12 (depends on 11) The substrate processing apparatus according to claim 11, wherein the thermal processing device performs post-exposure thermal processing on the substrate that has been exposed by the exposer. ### Claim 13 A thermal processing method for performing thermal processing on a substrate, including the steps of: supporting the substrate in a waiting section; heating the substrate in a heating section; and transporting the substrate between the waiting section and the heating section by moving a holder for holding the substrate, wherein the step of transporting includes respectively cooling a plurality of regions of the holder by a plurality of cooling portions provided in the holder.