# US 2018/0021803 A1 · Fluid discharge device, fluid discharge method, and fluid application device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2018/0021803 A1 - Document ID: US20180021803A1 - Status: Published application - Kind: A1 - Application number: 15/543,155 - Filed: 2016-01-13 - Published: 2018-01-25 - Earliest claimed: 2015-01-13 - Assignees: Senju Metal Industry Co., Ltd. - Applicants: Senju Metal Industry Co., Ltd. - Inventors: Takashi NAUCHI; Hideki NAKAMURA; Toshihiko MUTSUJI; Kazuya KITAZAWA - Web page: https://patentgrep.com/patent/US20180021803A1 ## CPC - B05C 5/001: {incorporating means for heating or cooling the liquid or other fluent material (B05C11/1042 takes precedence)} - B05C 5/00: Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work (B05C7/00 takes precedence; essentially involving spraying or electrostatic projection B05B) - B05C 5/0216: {by relative movement of article and outlet according to a predetermined path} - B05C 11/10: Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material {(B05C1/0813, B05C5/0225, B05C17/002 and B05C19/06 take precedence)} - B05D 1/26: performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface - B23K 3/06: Solder feeding devices; Solder melting pans - H05K 3/34: by soldering - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H10W 72/0112: {Apparatus for manufacturing bump connectors} - B05C 5/0254: {Coating heads with slot-shaped outlet (B05C5/0283 takes precedence)} - B05C 11/1002: {Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves} - H05K 2203/046: Means for drawing solder, e.g. for removing excess solder from pads - H05K 2203/074: Features related to the fluid pressure - H05K 2203/128: Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder - H10W 72/01204: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} - H10W 72/01223: {in liquid form, e.g. by dispensing droplets or by screen printing} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used. ## Claims ### Claim 1 A fluid discharge device for applying a fluid into a mask on a workpiece of an electronic component, the fluid discharge device comprising: a head part including a tank capable of containing a fluid, and a discharge head, wherein one end of the discharge head is provided with a suction port for sucking air in the mask on the workpiece, and a discharge nozzle for discharging the fluid, the suction port is installed in an advancing direction of the discharge head, the head part further comprises a heater unit for keeping the fluid in the tank at a desired temperature, and during preparation for fluid discharge, the discharge head moves closer to the workpiece until the discharge head contacts the workpiece, and during the fluid discharge, air in the mask is sucked from the suction port in a state where the discharge head is in contact with the workpiece, and then the fluid is discharged into the mask. ### Claim 2 (depends on 1) The fluid discharge device according to claim 1, wherein the discharge head includes a discharge nozzle and an opening having a slit-like shape as a suction port shape. ### Claim 3 (depends on 1) The fluid discharge device according to claim 1, wherein an extension pipeline to be connected to pressure supply means and a suction extension pipeline to be connected to depressurization supply means are installed at an upper part of the discharge head, and are respectively connected to a pressure generation source and a vacuum generation device. ### Claim 4 (depends on 1) The fluid discharge device according to claim 1, further comprising a fluid supply device for supplying an additional fluid into the tank when the fluid discharge device is in operation. ### Claim 5 (depends on 1) A fluid discharge method, wherein fluid is discharged, after air in a discharge part in a workpiece is removed, by using a fluid application device for applying a fluid onto a workpiece by discharging the fluid from a head by using the fluid discharge device according to claim 1, a suction port and a fluid discharge nozzle being provided at a tip of the head. ### Claim 6 A fluid application device for forming a coated portion on a workpiece of an electronic component, the fluid application device comprising: a discharge head including a tank capable of accommodating a fluid, and a nozzle formed at one end of the discharge head, the discharge head being configured to be positioned above the workpiece, the discharge head being configured in such a manner that the discharge head moves closer to the workpiece until the nozzle contacts the workpiece during preparation for formation of the coated portion; the discharge head moves horizontally with respect to the workpiece while ejecting the fluid in the tank from the nozzle in a state where the nozzle is in contact with the workpiece during formation of the coated portion; and the discharge head moves away from the workpiece after the formation of the coated portion is completed and the ejection of the fluid from the nozzle is stopped; a heater unit for keeping the fluid in the tank at a desired temperature; first pressure supply means for supplying a first pressure into the tank and ejecting the fluid in the tank onto the workpiece from an opening of the nozzle; second pressure supply means for supplying a second pressure into the tank and holding the fluid in the tank without ejecting the fluid from the opening of the nozzle; a pressure sensor for monitoring the pressure in the tank; and a control device for controlling a pressure to be supplied into the tank based on a signal from the pressure sensor. ### Claim 7 (depends on 6) The fluid application device according to claim 6, wherein the discharge head is configured to position the nozzle above the workpiece, the first pressure is a positive pressure, the second pressure is a negative pressure, the first pressure supply means includes a positive pressure supply source, and the second pressure supply means includes a negative pressure supply source. ### Claim 8 (depends on 7) The fluid application device according to claim 7, wherein the control device is configured to input data related to an amount of the fluid in the tank. ### Claim 9 (depends on 8) The fluid application device according to claim 8, further comprising a solder supply device for supplying an additional solder into the tank when the fluid application device is in operation. ### Claim 10 (depends on 6) The fluid application device according to claim 6, wherein the discharge head is configured to position the nozzle below the workpiece, the first pressure is a positive pressure, the second pressure is an atmospheric pressure or a positive pressure, and the first pressure supply means and the second pressure supply means include a common positive pressure supply source. ### Claim 11 (depends on 10) The fluid application device according to claim 10, wherein the control device is configured to input data related to an amount of fluid in the tank. ### Claim 12 (depends on 11) The fluid application device according to claim 11, further comprising a solder supply device for supplying an additional solder into the tank when the fluid application device is in operation. ### Claim 13 (depends on 6) The fluid application device according to claim 6, wherein the control device is configured to detect a position of the discharge head and control the first pressure supply means to supply the first pressure into the tank of the discharge head when the discharge head descends toward the workpiece and reaches a prescribed position. ### Claim 14 (depends on 1) The fluid discharge device according to claim 1, wherein the fluid is a molten solder. ### Claim 15 (depends on 6) The fluid application device according to claim 6, wherein the fluid is a molten solder.