Solder Preforms and Solder Alloy Assembly Methods
OwnerPaul Joseph Koep, Ellen S. Tormey +1inventors
InventorsPaul Joseph Koep, Ellen S. Tormey, Girard Sidone
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Abstract
A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
Claims8
1-9. (canceled)
A method of assembly, comprising:
- applying low temperature solder paste to an electronic substrate to form a solder paste deposit;
- placing a high temperature preform in the solder paste deposit;
- and
- processing the electronic substrate at a reflow temperature that is appropriate for the low temperature solder paste to create a low temperature solder joint resulting from a dissolution of the high temperature solder preform into the low temperature solder paste deposit.
A solder joint comprising:
- 49-53% by weight tin;
- 0-1.0% by weight silver;
- 0-0.1% by weight copper;
- and
- balance bismuth.
Dependencies are inferred from the claim text.