Electronic component and manufacturing method thereof

An electronic component comprising:

• a substrate including a principal surface;
• a chip arranged at the principal surface of the substrate;
• and
• a sealing resin that seals the chip on the principal surface of the substrate and that includes a resin principal surface that faces the principal surface of the substrate, a first resin side surface that extends from the resin principal surface toward the substrate along a first direction, a second resin side surface that extends from the resin principal surface toward the substrate along a second direction intersecting the first direction, and a corner portion that connects the first resin side surface and the second resin side surface and that has a curved surface curved outwardly.

An electronic component comprising:

• a substrate including a principal surface;
• a chip arranged at the principal surface of the substrate;
• and
• a sealing resin that seals the chip on the principal surface of the substrate and that includes a resin principal surface that faces the principal surface of the substrate, a resin side surface that extends from the resin principal surface toward the substrate, and a corner portion that connects the resin principal surface and the resin side surface and that has a curved surface curved outwardly.

A method for manufacturing an electronic component comprising the steps of:

• preparing a wafer that has a principal surface;
• setting a plurality of component formation regions each of which has a first side extending along a first direction and a second side extending along a second direction intersecting the first direction to the principal surface of the wafer and arranging a chip in each of the plurality of component formation regions;
• and
• cutting out a plurality of electronic components by cutting the wafer along a peripheral edge of each of the component formation regions so that a corner portion connecting the first side and the second side is curved outwardly.