Embedded dry film battery module and method of manufacturing thereof

A method of manufacturing a packaged electronics module comprising:

• providing a first dielectric layer;
• providing a dry film battery directly on the first dielectric layer;
• attaching one or more electronic components to the first dielectric layer;
• forming a plurality of vias through the first dielectric layer;
• and
• forming metal interconnects in the plurality of vias formed through the first dielectric layer, the metal interconnects forming electrical interconnections to the one or more electronic components and to the dry film battery.

A packaged electronics module comprising:

• a dielectric layer having a first surface and a second surface;
• a plurality of electronic components attached to the dielectric layer on the first surface, the plurality of electronic components comprising:
• a microelectromechanical system (MEMS) type sensor;
• and
• a communications chip set including a semiconductor device and a communications device;
• a dry film battery attached to the dielectric layer on the first surface;
• metal interconnects formed in a plurality of vias formed through the dielectric layer and out onto the second surface of the dielectric layer, the metal interconnects being mechanically and electrically coupled to the MEMS type sensor the communications chip set;
• and
• an electrically insulating substrate applied onto the first surface of the dielectric layer and over the MEMS type sensor the communications chip set, so as to embed the MEMS type sensor the communications chip set therein.