# US 2018/0020537 A1 · Method for producing flexible mounting module body

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2018/0020537 A1
- Document ID: US20180020537A1
- Status: Published application
- Kind: A1
- Application number: 15/711,548
- Filed: 2017-09-21
- Published: 2018-01-18
- Earliest claimed: 2015-03-26
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Takayuki MATSUSHIMA
- Web page: https://patentgrep.com/patent/US20180020537A1

## CPC

- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 3/32: electrically connecting electric components or wires to printed circuits
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/0221: Insulating particles having an electrically conductive coating
- H05K 2201/10128: Display
- H10W 72/073: {of die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for producing a flexible mounting substrate. The method comprises preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump, arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region, arranging the electronic component on the anisotropic conductive film, and pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate, and adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion located on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region.

## Claims

### Claim 1

A method for producing a flexible mounting substrate, the method comprising:
preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump;
arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region;
arranging the electronic component on the anisotropic conductive film;
pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate; and
adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region,
wherein the adhesive layer includes spherical particles having an average particle diameter in a range of 75% to 95% of a thickness of the adhesive layer and a 10% compression pressure of at least 10 MPa.

### Claim 2 (depends on 1)

The method for producing a flexible mounting substrate according to claim 1, wherein in the adhering, the adhesion film is arranged and adhered at a portion located on a back surface side of an image display region on the support surface.

### Claim 3 (depends on 1)

The method for producing a flexible mounting substrate according to claim 1, wherein the adhesive layer of the adhesion film includes the spherical particles in a range of 10 parts to 40 parts by volume relative to 100 parts by volume of the adhesive in the adhesive layer.

### Claim 4 (depends on 2)

The method for producing a flexible mounting substrate according to claim 2, wherein the adhesive layer of the adhesion film includes the spherical particles in a range of 10 parts to 40 parts by volume relative to 100 parts by volume of the adhesive in the adhesive layer.