Flexible and conformal electronics using rigid substrates
AssigneeBrigham Young University (BYU)
InventorsBryce Parker DEFIGUEIREDO, Spencer Magleby, Larry Howell
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Abstract
A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.
Claims20
A flexible electronics assembly comprising:
- a single-piece substrate, the substrate including two regions of rigidity separated by a localized region of flexibility, the localized region of flexibility having a lower rigidity than the two regions of rigidity;
- and
- at least one electronic component mounted on at least one of the two regions of rigidity,
- the two regions of rigidity being angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility.
A method, comprising:
- geometrically modifying a single-piece substrate to include a localized region of flexibility separating two regions of rigidity, the localized region of flexibility having a lower rigidity than the two regions of rigidity;
- and
- configuring the localized region of flexibility separating the two regions of rigidity as a hinge to angularly deflect the two regions of rigidity from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate.
Dependencies are inferred from the claim text.