Stacked chip microphone
AssigneeKnowles Electronics, LLC
InventorsSung B. Lee, Wade Conklin, Michael Kuntzman, Sandra Vos
Life of this patent
Estimating the term…
Abstract
A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.
Claims20
A microphone device comprising:
- a base;
- a port formed in the base;
- a cover attached to the base that forms a housing interior with the base;
- an MEMS element disposed in the housing interior and on top of the port, wherein the MEMS element includes a diaphragm and a backplate opposing the diaphragm;
- an integrated circuit stacked on top of the MEMS element, wherein the integrated circuit includes an active surface and a substrate supporting the active surface, wherein the active surface comprises circuitry for processing signals produced by the MEMS element, wherein the substrate is between the MEMS element and the active surface;
- and
- solder bumps forming a connection between the MEMS element and the integrated circuit, the solder bumps forming air gaps between the MEMS element, the integrated circuit, and the solder bumps through which air flows from the MEMS element to a back volume of the microphone device.
(canceled)
(canceled)
(canceled)
A microphone device comprising:
- a base;
- a port formed in the base;
- a cover attached to the base that forms a housing interior with the base;
- an MEMS element disposed in the housing interior and on top of the port, wherein the MEMS element includes a diaphragm and a backplate opposing the diaphragm, and wherein the MEMS element is attached to the base through first solder bumps;
- and
- an integrated circuit stacked on top of the MEMS element through second solder bumps, the second solder bumps forming air gaps between the MEMS element, the integrated circuit, and the second solder bumps through which air flows from the MEMS element to a back volume of the microphone device.
(canceled)
Dependencies are inferred from the claim text.