Camera module and method for the production thereof
AssigneeConti Temic microelectronic GmbH
InventorBoris WERTHESSEN
Life of this patent
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Abstract
A camera module includes a circuit carrier, an image sensor chip arranged on the circuit carrier and an optics module with an optics housing accommodating a lens. Provision is made for the optics housing to be embodied with at least three press-fit pins, the optics housing to be connected to the circuit carrier by way of the three press-fit pins with a predetermined distance from the circuit carrier, wherein the circuit carrier is embodied with at least three press-fit holes for establishing a press-fit connection by the press-fit pins. Furthermore, the invention relates to a method for producing the camera module.
Claims16
A camera module comprising:
- a circuit carrier,
- an image sensor chip arranged on the circuit carrier, and
- an optics module with an optics housing accommodating a lens, wherein
- the optics housing is embodied with at least three press-fit pins, and
- the optics housing is connected to the circuit carrier by way of the at least three press-fit pins with a predetermined distance from the circuit carrier, wherein the circuit carrier is embodied with at least three press-fit holes for establishing a press-fit connection with the press-fit pins.
A method for producing a camera module comprising:
- providing a circuit carrier, on which an image sensor chip is arranged,
- providing an optics module with an optics housing accommodating a lens,
- embodying the optics housing with at least three flexible press-fit pins, and
- connecting the optics housing to the circuit carrier by way of the three flexible press-fit pins with a predetermined distance from the circuit carrier, wherein the circuit carrier is embodied with at least three press-fit holes for establishing a press-fit connection by the press-fit pins.
Dependencies are inferred from the claim text.