Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module, comprising:

• at least two optical lenses;
• and
• a molded photosensitive assembly, which comprises:
• at least a circuit board having at least two coupling areas on a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said at least two coupling areas thereof;
• at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said at least two coupling areas of said circuit board respectively, wherein one or more connecting elements electrically connect said non-photosensitive areas of said at least two photosensitive units with said circuit board;
• a molded base integrally coupled at said circuit board to integrally encapsulate and enclose said electronic elements and said connecting elements therein that prevents said electronic elements and said connecting elements from exposing to outside and isolates said electronic elements and said connecting elements with each other to prevent mutual interference therebetween, so as to reduce a distance between every two of said electronic elements and said connecting elements to reduce a size of said molded photosensitive assembly, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two optical paths for said at least two photosensitive units respectively, wherein said at least two optical windows are upwardly and outwardly extended from said two non-photosensitive areas of said at least two photosensitive units respectively, such that each of said optical windows is configured to have a tapered size that a cross section of each of said optical windows is gradually increased from bottom to top to prevent stray light reflection to said respective photosensitive unit, wherein said molded base is molded to have a flat top side and said at least two optical lenses are installed on top of said molded base and located along said at least two optical paths of said at least two photosensitive units respectively such that said at least two optical windows form at least two light channels through said at least two photosensitive units and said at least optical lenses;
• and
• at least two lens barrels integrally molded to be extended from said top side of said molded base and aligned with said two optical windows and said two photosensitive units respectively to form an integrated body, wherein said at least two optical lenses are mounted in said at least two lens barrels along said at least two optical paths of said at least two photosensitive units to form said array imaging module.