EMI Shield With A Lens-Sized Aperture For Camera Modules and Camera Modules Including the Same

An EMI shield for a camera module, said EMI shield comprising:

• a first conductive structure including an optical unit receiving portion and a circuit substrate mounting portion surrounding said optical unit receiving portion, said optical unit receiving portion defining a light-admitting aperture at an end opposite said circuit substrate mounting portion;
• a second conductive structure configured to abut said first conductive structure around at least a portion of a perimeter of said circuit substrate mounting portion;
• and wherein
• said optical unit receiving portion is configured to receive an optical unit of a camera module therein;
• said circuit substrate mounting portion is configured to be coupled to a first surface of a circuit substrate of said camera module when said optical unit is positioned in said optical unit receiving portion, said optical unit being coupled to said first surface of said circuit substrate;
• and
• said second conductive structure is configured to cover a second surface of said circuit substrate when said second conductive structure is positioned to abut said first conductive structure, said second surface of said circuit substrate being opposite to said first surface.

A method for manufacturing a camera module, said method comprising:

• providing a camera module subassembly including a circuit substrate, an image sensor mounted on said circuit substrate, and an optical unit;
• providing a first conductive portion of an EMI shield;
• mounting said first conductive portion of an EMI shield on said camera module subassembly, said first conductive portion covering said optical unit and a first surface of said circuit substrate of said camera module subassembly;
• providing a second conductive portion of an EMI shield;
• and
• mounting said second conductive portion of said EMI shield on said camera module subassembly such that said second conductive portion is coupled to said first conductive portion, said second conductive portion covering a second surface of said circuit substrate opposite to said first surface.

A method for manufacturing a camera module, said method comprising:

• providing a camera module subassembly including a circuit substrate, an image sensor mounted on said circuit substrate, and an optical unit;
• providing a flexible sheet of conductive material;
• wrapping said camera module subassembly in said flexible sheet;
• and wherein
• said step of wrapping includes covering said optical unit and a first surface of said circuit substrate having said optical unit mounted thereon with said flexible sheet;
• and
• said step of wrapping further includes covering an entire second surface of said circuit substrate with said flexible sheet, said second surface being opposite to said first surface.

A camera module comprising:

• a circuit substrate having a top surface, a bottom surface opposite said top surface, and a sidewall between said top surface and said bottom surface;
• an image sensor mounted on said circuit substrate, said image sensor including a pixel array of photosensing pixels formed therein;
• a optical unit coupled to said top surface of said circuit substrate over said pixel array, said optical unit including at least one optical element, said optical unit being configured to focus an image on said pixel array;
• and
• means for shielding said image sensor, said optical unit, said top surface, said bottom surface, and said sidewall of said circuit substrate from electromagnetic radiation.