Interconnect method for implementing scale-up servers
AssigneeCisco Technology, Inc.
InventorsVictor Odisho, Bidyut Kanti Sen, Jayaprakash Balachandran, Michael Leung
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AssigneeCisco Technology, Inc.
InventorsVictor Odisho, Bidyut Kanti Sen, Jayaprakash Balachandran, Michael Leung
Estimating the term…
An embodiment includes a first server including a first processor electrically connected to a second processor; a second server including a third processor electrically connected to a fourth processor; a first connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a first connection via the first connection plane and one of the first and second processors is connected to one of the third and fourth processors by a second connection via the first connection plane; and a second connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a third connection via the second connection plane and wherein one of the first and second processors is connected to one of the third and fourth processors by a fourth connection via the second connection plane.
An apparatus for implementing a Symmetric Multi-Processing (“SMP”) system, the apparatus comprising:
An method for implementing a Symmetric Multi-Processing (“SMP”) system, the method comprising:
An apparatus for implementing a Symmetric Multi-Processing (“SMP”) system, the apparatus comprising:
Dependencies are inferred from the claim text.