Socket contact techniques and configurations

A method comprising:

• providing a socket substrate including:
• a first side and a second side disposed opposite to the first side;
• an opening formed through the socket substrate, wherein the opening extends from the first side to the second side and a surface of the socket substrate extends from the first side to the second side along the opening;
• an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and the surface of the socket substrate that extends along the opening are plated with a metal;
• and
• coupling the electrical contact with a circuit board, wherein the electrical contact is configured to electrically couple with a die package.