Substrate processing system and substrate processing method

A substrate processing system comprising:

• a chamber;
• a susceptor disposed inside the chamber and allowing a substrate to be seated thereon;
• a mask member disposed over the substrate;
• and
• a controller for controlling an arrangement height of the mask member with respect to the substrate,
• wherein an encapsulation layer covering a device formed on the substrate is formed using the mask member adjusted in height by the controller.

A substrate processing system comprising:

• a first chamber;
• a first mask member disposed inside the first chamber and forming a first encapsulation layer so as to cover a device formed on an upper surface of a substrate in the first chamber;
• a second chamber disposed independently of the first chamber and forming a second encapsulation layer over the first encapsulation layer;
• a third chamber disposed independently of the second chamber;
• and
• a second mask member having the same mask pattern as the first mask member formed therein, disposed inside the third chamber, and forming a third encapsulation layer over the second encapsulation layer in the third chamber.