Top electrode for device structures in interconnect
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsia-Wei Chen, Wen-Ting Chu, Kuo-Chi Tu, Chih-Yang Chang, Chin-Chieh Yang, Yu-Wen Liao, Wen-Chun You, Sheng-Hung Shih
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Abstract
Some embodiments relate to an integrated circuit device, which includes a bottom electrode, a dielectric layer, and top electrode. The dielectric layer is disposed over the bottom electrode. The top electrode is disposed over the dielectric layer, and an upper surface of the top electrode exhibits a recess. A via is disposed over the top electrode. The via makes electrical contact with only a tapered sidewall of the recess without contacting a bottom surface of the recess.
Claims20
An integrated circuit device, comprising:
- a bottom electrode;
- a dielectric layer disposed over the bottom electrode;
- a top electrode disposed over the dielectric layer, wherein an upper surface of the top electrode comprises a tapered recess;
- and
- a via disposed over the top electrode, wherein the via establishes electrical contact with an inner sidewall of the tapered recess but not with a central bottom surface of the tapered recess.
An integrated circuit device, comprising:
- a bottom electrode;
- an insulating layer disposed over the bottom electrode;
- a top electrode disposed over the insulating layer and separated from the bottom electrode by the insulating layer, the top electrode comprising a peripheral top surface region and a central top surface region, the central top surface region being recessed relative to the peripheral top surface region;
- and
- a via disposed over the top electrode, wherein the via establishes electrical contact with an inner sidewall of the top electrode that connects the peripheral top surface region to the central top surface region.
An integrated circuit device, comprising:
- a bottom electrode;
- a dielectric layer disposed over the bottom electrode;
- a top electrode disposed over the dielectric layer, wherein an upper surface of the top electrode exhibits a recess;
- and
- a via disposed over the top electrode, wherein the via makes electrical contact with only a tapered sidewall of the recess without contacting a bottom surface of the recess.
Dependencies are inferred from the claim text.