Led flip chip die-bond conductive adhesive structure and mounting method thereof

A method for mounting an LED flip chip die-bond conductive adhesive structure, comprising the following steps:

• (a) dispensing a thermosetting die-bond insulating adhesive in a central position region of a nonmetallic region between circuit board positive and negative electrodes between a circuit board positive electrode region and a circuit board negative electrode region on an electronic circuit board on an automatic die bonder;
• (b) then performing die-bonding conductive adhesion on the LED flip chip and the electronic circuit board, and enabling two central position regions between a nonmetallic region between the LED flip chip positive electrode and the LED flip chip negative electrode and a nonmetallic region between the circuit board positive electrode and the circuit board negative electrode to be coincided;
• and
• (c) heating coincided elements, and shrinking volume of the thermosetting die-bond insulating adhesive after cooling, thereby realizing metal-metal contact type conductive connection between the LED flip chip positive electrode region and the circuit board positive electrode region and between the LED flip chip negative electrode region and the circuit board negative electrode region.