Electronic device and methods of fabricating the same
AssigneeElectronics and Telecommunications Research Institute
InventorsDoo Hyeb Youn, Sun Jin YUN, Changbong YEON, Young-Jun YU
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Abstract
Disclosed are an electronic device and a method of fabricating the same. The method of fabricating an electronic device comprises providing on a substrate a channel layer including a two-dimensional material, providing a metal fiber layer on a first surface of a conductive layer, providing the metal fiber layer on the channel layer, and performing a thermal treatment process to form a junction layer where a portion of the metal fiber layer is covalently bonded to a portion of the channel layer.
Claims17
A method of fabricating an electronic device, the method comprising:
- providing on a substrate a channel layer including a two-dimensional material;
- providing a metal fiber layer on a first surface of a conductive layer;
- providing the metal fiber layer on the channel layer;
- and
- performing a thermal treatment process to form a junction layer where a portion of the metal fiber layer is covalently bonded to a portion of the channel layer.
An electronic device, comprising:
- a channel layer on a substrate and including a two-dimensional material;
- a metal fiber layer on the channel layer;
- and
- a junction layer between the metal fiber layer and the channel layer, wherein the junction layer is formed by a covalent bonding between the metal fiber layer and the channel layer.
Dependencies are inferred from the claim text.