Lateral bipolar junction transistor with controlled junction
AssigneeInternational Business Machines Corporation
InventorsKarthik Balakrishnan, Pouya Hashemi, Tak H. Ning, Alexander Reznicek
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AssigneeInternational Business Machines Corporation
InventorsKarthik Balakrishnan, Pouya Hashemi, Tak H. Ning, Alexander Reznicek
Estimating the term…
A method of forming a lateral bipolar junction transistor (LBJT) that includes providing a germanium containing layer on a crystalline oxide layer, and patterning the germanium containing layer stopping on the crystalline oxide layer to form a base region. The method may further include forming emitter and collector extension regions on opposing sides of the base region using ion implantation, and epitaxially forming an emitter region and collector region on the crystalline oxide layer into contact with the emitter and collector extension regions. The crystalline oxide layer provides a seed layer for the epitaxial formation of the emitter and collector regions.
A lateral bipolar junction transistor (LBJT) device comprising:
A method of forming a lateral bipolar junction transistor (LBJT) comprising:
The method of claim 16, wherein the emitter region and collector region comprise polycrystalline or single crystalline semiconductor material, wherein the polycrystalline or single crystalline semiconductor material is grown on the nucleation dielectric layer.
The method of claim 15, wherein the crystalline oxide layer is selected from the group consisting of cerium oxide (CeO2), lanthanum oxide (La2O3), yttrium oxide (Y2O3), gadolinium oxide (Gd2O3), europium oxide (Eu2O3), terbium oxide (Tb2O3), and combinations thereof.
A method of forming a lateral bipolar junction transistor (LBJT) comprising:
Dependencies are inferred from the claim text.