Semiconductor Device Including a Super Junction Structure in a SiC Semiconductor Body
AssigneeInfineon Technologies AG
InventorsAnton Mauder, Rudolf Elpelt, Dethard Peters
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AssigneeInfineon Technologies AG
InventorsAnton Mauder, Rudolf Elpelt, Dethard Peters
Estimating the term…
An embodiment of a semiconductor device includes a body region of a first conductivity type in a SiC semiconductor body of a second conductivity type. A super junction structure is in the SiC semiconductor body, and includes a drift zone section being of the second conductivity type and a compensation structure of the first conductivity type. The compensation structure adjoins the body region and includes compensation sub-structures consecutively arranged along a vertical direction perpendicular to a surface of the SiC semiconductor body. The compensation sub-structures include a first compensation sub-structure and a second compensation sub-structure. A resistance of the second compensation sub-structure between opposite ends of the second compensation sub-structure along the vertical direction is at least five times larger than a resistance of the first compensation sub-structure between opposite ends of the first compensation sub-structure along the vertical direction.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.