Semiconductor device, manufacturing method thereof, and electronic apparatus

A semiconductor device, comprising:

• a first substrate including a pixel array and first connection pads;
• a second substrate bonded to the first substrate, the second substrate including second connection pads and a logic circuit for driving the pixel array, wherein the first connection pads are located at a different level in the semiconductor device than the second connection pads;
• and
• connection wirings that electrically connect the first connection pads to the second connection pads,
• wherein, in a plan view, pairs including one of the first connection pads and one of the second connection pads form a connection pad array, and
• wherein, in the plan view, at least one of the first connection pads partially overlaps at least one of the second connection pads.

An electronic apparatus, comprising:

• a semiconductor device, including:
• a first substrate including a pixel array and first connection pads;
• a second substrate bonded to the first substrate, the second substrate including second connection pads and a logic circuit for driving the pixel array, wherein the first connection pads are located at a different level in the semiconductor device than the second connection pads;
• and
• connection wirings that electrically connect the first connection pads to the second connection pads,
• wherein, in a plan view, pairs including one of the first connection pads and one of the second connection pads form a connection pad array, and
• wherein, in the plan view, at least one of the first connection pads partially overlaps at least one of the second connection pads;
• and
• an optical system that guides light to the pixel array.