Image pickup unit and method of manufacturing the same
AssigneeSony Semiconductor Solutions Corporation
InventorsMASAYA NAGATA, TAIZO TAKACHI
Life of this patent
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Abstract
An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal member including a concave portion, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. By way of a second example, the image pickup device includes a seal member having a first surface, the first surface being a polished surface, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member.
Claims14
An image pickup device, comprising:
- an optically-transparent seal member that comprises a first surface and a second surface, wherein the second surface is opposite to the first surface, and wherein the optically-transparent seal member includes an outer region and an inner region;
- an optical device coupled to the second surface, wherein the optical device includes an optical sensor with a light receiving surface;
- and
- a resin layer configured to fill a gap between the light receiving surface and the second surface.
An image pickup device, comprising:
- an optically-transparent seal member that comprises a first surface, wherein the first surface is a polished surface and includes a concave portion,
- wherein the concave portion includes an outer region as a light waveguide, and an inner region;
- an optical device coupled to a second surface of the optically-transparent seal member, wherein the second surface is opposite to the first surface, wherein the optical device includes an optical sensor with a light receiving surface;
- and
- a resin layer configured to fill a gap between the light receiving surface and the second surface.
Dependencies are inferred from the claim text.