Sensor package structure

A sensor package structure, comprising:

• a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the upper surface of the substrate includes a die bonding zone and a wiring zone arranged outside of the die bonding zone;
• a sensing member having a width more than or equal to 10 mm and mounted on the die bonding zone of the substrate, wherein a top surface of the sensing member arranged distant from the substrate includes a sensing zone, a carrying zone having a ring shape and arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone;
• a shielding member including a translucent covering portion and a ring-shaped supporting portion connected to a peripheral portion of the covering portion, wherein the supporting portion having a height more than or equal to 300 μm is fixed on the carrying zone of the sensing member, the shielding member and the top surface of the sensing member surroundingly co-define an enclosed accommodating space, and the sensing zone is arranged in the accommodating space;
• at least one metallic wire having two opposite ends, wherein the two ends of the at least one metallic wire are respectively connected to the wiring zone of the substrate and the connecting zone of the sensing member to establish an electrical connection between the substrate and the sensing member;
• and
• an encapsulating compound disposed on the wiring zone and covering a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member, wherein the at least one metallic wire is embedded in the encapsulating compound.