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US 2018/0019246 A1Published application
Method of manufacturing semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
AssigneeSamsung Electronics Co., Ltd.
InventorsJun-Kyum KIM, Jung-Woo SEO, Sung-Un KWON
Life of this patent
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Abstract
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Claims20
A semiconductor device comprising:
- a substrate having a plurality of active areas;
- a plurality of bit line structures formed on the substrate, each comprising a bit line extending in a first direction and a bit line spacer layer extending along two opposing side surfaces of the bit line;
- a plurality of contact holes spaced apart from one another in a lengthwise direction in a space between ones of the plurality of bit line structures;
- a plurality of first contact plugs filling respective bottom portions of the plurality of contact holes and electrically connected with respective ones of the plurality of active areas;
- and
- a plurality of second contact plugs electrically connected with respective ones of the plurality of first contact plugs, and on the respective ones of the plurality of bit line structures, wherein the plurality of second contact plugs are laid out on respective upper surfaces of the plurality of bit line structures in a hexagonal array structure and wherein each of the second contact plugs has a diamond-shaped cross-sectional plane.
3 more elements
A semiconductor device comprising:
- a substrate having a plurality of active areas;
- a plurality of bit line structures formed on the substrate, each comprising a bit line extending in a first direction and a bit line spacer layer extending along two side surfaces of the bit line;
- a plurality of first contact plugs spaced apart from one another in a lengthwise direction of a space between ones of the plurality of bit line structures, and electrically connected with respective ones of the plurality of active areas;
- and
- a plurality of second contact plugs electrically connected with respective ones of the plurality of first contact plugs and on respective ones of the plurality of bit line structures,
- wherein two of the plurality of second contact plugs corresponding to one of the plurality of active areas, have different size areas overlapping the one of the plurality of active areas in a direction that is perpendicular to a main surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.