Micro-led array display devices
AssigneeLumens Co., Ltd.
InventorsHanBeet CHANG, EunSung SHIN, HyunYong CHO
Life of this patent
Estimating the term…
Abstract
Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.
Claims14
A micro-LED array display device comprising:
- a micro-LED panel comprising a plurality of micro-LED pixels;
- a CMOS backplane comprising a plurality of CMOS cells corresponding to the micro-LED pixels;
- and
- bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells,
- wherein the micro-LED pixels have a vertical structure comprising a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer in this order on a substrate,
- wherein the active layer and the second conductivity-type semiconductor layer are removed from exposed portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels on the substrate is formed,
- wherein a first conductivity-type metal layer is formed over the extended portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels is formed and is spaced apart from the micro-LED pixels,
- wherein the first conductivity-type metal layer functions as a common electrode of the micro-LED pixels, and
- wherein the micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.
A micro-LED array display device to achieve full color comprising:
- first, second, and third micro-LED panels emitting light of different wavelength bands, each of the micro-LED panels comprising a plurality of micro-LED pixels;
- a single CMOS backplane comprising a plurality of CMOS cells corresponding to the micro-LED pixels;
- and
- bumps electrically connecting the micro-LED pixels of the first, second, and third micro-LED panels to the corresponding CMOS cells in a state in which the micro-LED pixels of the first, second, and third micro-LED panels are arranged to face the CMOS cells,
- wherein the micro-LED pixels of each of the first, second, and third micro-LED panels have a vertical structure comprising a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer in this order on a substrate, and the active layer and the second conductivity-type semiconductor layer are removed from exposed portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels of each of the first, second, and third micro-LED panels are formed,
- wherein a first conductivity-type metal layer is formed over the extended portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels of each of the first, second, and third micro-LED panels is formed and is spaced apart from the micro-LED pixels of each of the first, second, and third micro-LED panels,
- wherein the first conductivity-type metal layer functions as a common electrode of the micro-LED pixels, and
- wherein the micro-LED pixels of the first, second, and third micro-LED panels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.
Dependencies are inferred from the claim text.