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US 2018/0019224 A1Published application
Wedge bonding component
AssigneeKYOCERA Corporation
InventorHidekazu Shigeyoshi
Life of this patent
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Abstract
There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
Claims5
A wedge bonding component having a surface for contacting a wire, wherein
- at least a part of the surface comprises a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessary ingredient.
Dependencies are inferred from the claim text.