US 2018/0019223 A1 · MOUNTING DEVICE AND MOUNTING METHOD

Abstract

A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.

Claims20

Dependent claims

A mounting device with which a semiconductor chip that has electrodes on top and bottom faces is bonded by thermocompression to a joined piece that is disposed on a lower side of the semiconductor chip and has an electrode on a top face, in a state in which a thermosetting adhesive is interposed between the semiconductor chip and the joined piece, the mounting device comprising:

a thermocompression bonding head configured to heat the semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to the joined piece by compression, the thermocompression bonding head having a suction hole in a face that holds the semiconductor chip;
a pressure reduction mechanism communicating with the suction hole and configured to reduce pressure inside the suction hole;
and
a resin sheet feed mechanism configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip,
the electrode protruding from the top face of the semiconductor chip being bonded by thermocompression after being embedded in the resin sheet.

2 more elements

A mounting method for bonding a semiconductor chip that has electrodes on top and bottom faces to a joined piece that is disposed on a lower side of the semiconductor chip and has an electrode on a top face by thermocompression, in a state in which a thermosetting adhesive is interposed between the semiconductor chip and the joined piece, the method comprising:

holding the semiconductor chip with a thermocompression bonding head by suction via a resin sheet in which a through-hole is formed at a position corresponding to a suction hole in the thermocompression bonding head;
embedding the electrode protruding from the top face of the semiconductor chip in the resin sheet in a state in which the thermocompression bonding head has been brought to a specific temperature or below;
and
raising a temperature setting of the thermocompression bonding head to join the electrode on the bottom face of the semiconductor chip to the electrode on the top face of the joined piece, and to harden the thermosetting adhesive with heat.

1 more element

Dependencies are inferred from the claim text.

Mounting device and mounting method

Life of this patent

Mounting device and mounting method

Life of this patent

Abstract

Claims20