Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsBernd Karl APPELT, Kay Stefan ESSIG, Chi-Tsung CHIU
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Abstract
A semiconductor package device includes a first die, an adhesive layer, and an encapsulant layer. The first die comprises a first electrode at a first surface of the first die and a second electrode at a second surface of the first die opposite to the first surface of the first die. The adhesive layer is disposed on the first surface of the first die. The encapsulant layer encapsulates the first die and the adhesive layer, wherein substantially an entire surface of the second electrode is exposed from the encapsulant layer.
Claims20
A semiconductor package device, comprising:
- a first die having a first surface and a second surface opposite to the first surface, the first die comprising a first electrode disposed at the first surface of the first die and a second electrode disposed at the second surface of the first die;
- an adhesive layer disposed on the first surface of the first die;
- and
- an encapsulant layer encapsulating the first die and the adhesive layer, wherein substantially an entire surface of the second electrode is exposed from the encapsulant layer.
A method of manufacturing a semiconductor package device, the method comprising:
- providing a carrier having a first conductive layer disposed thereon;
- attaching a first side of a first die to the carrier through a first adhesive layer, the first die comprising a first electrode disposed at the first side and a second electrode disposed at a second side opposite to the first side;
- encapsulating the first die and the first adhesive layer with an encapsulant such that substantially an entire surface of the second electrode of the first die is exposed from the encapsulant;
- and
- removing the carrier.
Dependencies are inferred from the claim text.