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AssigneeIntel Corporation
InventorsSrinivas V. Pietambaram, Kyu Oh Lee
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A surface finish may be formed in a microelectronic structure, wherein the surface finish may include a multilayer interlayer structure. Thus, needed characteristics, such as compliance and electro-migration resistance, of the interlayer structure may be satisfied by different material layers, rather attempting to achieve these characteristics with a single layer. In one embodiment, the multilayer interlayer structure may comprises a two-layer structure, wherein a first layer is formed proximate a solder interconnect and comprises a material which forms a ductile joint with the solder interconnect, and a second layer comprising a material having strong electro-migration resistance formed between the first layer and an interconnection pad. In a further embodiment, third layer may be formed adjacent the interconnection pad comprising a material which forms a ductile joint with the interconnection pad.
-25. (canceled)
A microelectronic structure, comprising:
A method of fabricating a microelectronic structure, comprising:
An electronic system, comprising:
Dependencies are inferred from the claim text.