Method for processing an electronic component and an electronic component
AssigneeInfineon Technologies AG
InventorsJens Peter Konrath, Jochen Hilsenbeck
Life of this patent
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Abstract
According to various embodiments an electronic component includes: at least one electrically conductive contact region; a contact pad including a self-segregating composition disposed over the at least one electrically conductive contact region; a segregation suppression structure disposed between the contact pad and the at least one electrically conductive contact region, wherein the segregation suppression structure includes more nucleation inducing topography features than the at least one electrically conductive contact region for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad defined by the nucleation inducing topography features.
Claims20
An electronic component comprising:
- at least one electrically conductive contact region;
- a contact pad comprising a self-segregating composition disposed over the at least one electrically conductive contact region;
- a segregation suppression structure disposed between the contact pad and the at least one electrically conductive region, and
- wherein the segregation suppression structure comprises more nucleation inducing topography features than the at least one electrically conductive contact region for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad defined by the nucleation inducing topography features.
An electronic component comprising,
- at least one electrically conductive surface;
- a metallization comprising a self-segregating composition disposed over the at least one electrically conductive surface;
- a segregation suppression structure disposed between the metallization and the at least one electrically conductive surface,
- wherein the segregation suppression structure comprises more nucleation inducing topography features than the at least one electrically conductive surface for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the metallization defined by the nucleation inducing topography features.
An electronic component comprising:
- at least one electrically conductive surface;
- a metallization comprising a self-segregating composition disposed over the at least one electrically conductive surface;
- a segregation suppression structure disposed between the metallization and the at least one electrically conductive surface,
- wherein the segregation suppression structure comprises a greater area density of nucleation inducing topography features than the at least one electrically conductive surface for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the metallization defined by the nucleation inducing topography features.
Dependencies are inferred from the claim text.