Antenna on integrated circuit package
AssigneeAtmel Corporation
InventorsHassan Hashemi, Mamdouh Atia, Igor Radutnuy
Life of this patent
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Abstract
An antenna on integrated circuit (IC) package is disclosed. In an embodiment, an IC package comprises: a substrate; a radio frequency (RF) transceiver attached to the substrate; mold compound encapsulating the substrate; a shield layer formed on the mold compound; and one or more vias extending vertically through the shield layer and the mold compound, providing a conductive path to the RF transceiver. In another embodiment, a method comprises: attaching a radio frequency (RF) transceiver to a substrate; encapsulating the substrate with mold compound; forming a shield layer on the mold compound; and forming one or more vias through the shield layer and mold compound, providing a conductive path to the RF transceiver.
Claims8
An integrated circuit (IC) package comprising:
- a substrate;
- a radio frequency (RF) transceiver attached to the substrate;
- mold compound encapsulating the RF transceiver;
- an electromagnetic interference (EMI) shield layer formed over the mold compound to provide at least a portion of an outer surface of the package;
- and
- one or more vias extending vertically through the EMI shield layer and the mold compound, providing a conductive path to the RF transceiver.
A method of fabricating an integrated circuit (IC) package, comprising:
- attaching a radio frequency (RF) transceiver to a substrate;
- encapsulating the RF transceiver with mold compound;
- forming an electromagnetic interference (EMI) shield layer over the mold compound to provide at least a portion of an outer surface of the package;
- and
- forming one or more vias through the EMI shield layer and mold compound, providing a conductive path to the RF transceiver.
An integrated circuit (IC) package comprising:
- a substrate;
- a radio frequency (RF) transceiver attached to the substrate;
- a surface mount discrete component attached to the substrate and coupled to the RF transceiver;
- mold compound encapsulating the surface mount discrete component;
- an electromagnetic interference (EMI) shield layer formed over the mold compound to provide at least a portion of an outer surface of the package;
- and
- an opening extending vertically through the EMI shield layer and the mold compound, the opening exposing a portion of the surface mount discrete component.
A method of fabricating an integrated circuit (IC) package, comprising:
- attaching a radio frequency (RF) transceiver to a substrate;
- attaching a surface-mount device to the substrate;
- coupling the surface-mount device to the RF receiver;
- encapsulating the RF transceiver and surface-mount device with mold compound;
- forming an electromagnetic interference (EMI) shield layer over the mold compound to provide at least a portion of an outer surface of the package;
- and
- removing a portion of the EMI shield layer to expose a portion of the surface-mount device.
Dependencies are inferred from the claim text.