Semiconductor package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Woo CHOI, Hyun Kook CHO, Hyuk Joo YOON, Hyuk Ki KWON
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Abstract
A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
Claims18
A semiconductor package, comprising:
- a substrate comprising a mounted electronic device;
- a sealer configured to seal the electronic device;
- and
- a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate,
- wherein the substrate comprises a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
A method of manufacturing a semiconductor package, comprising:
- configuring a strip substrate having a groove formed in a lower surface thereof;
- mounting an electronic device on one surface of the strip substrate;
- forming a sealer sealing the electronic device;
- configuring the strip substrate on which the sealer is formed to be cut along the groove to form a semiconductor package in a half-finished product state, including a spacer;
- and
- forming a conductive blocking film on a surface of the sealer and a cut surface of the strip substrate.
A method of manufacturing a semiconductor package, comprising:
- mounting an electronic device on one surface of a substrate;
- forming a sealer sealing the electronic device;
- seating the substrate on which the sealer is formed, on a base board;
- applying a conductive material onto a surface of the sealer and a side surface of the substrate;
- and
- separating the semiconductor package from the base board,
- wherein, when the substrate is seated on the base board, a lower portion of the side surface of the substrate is spaced apart from the base board.
A semiconductor package, comprising:
- a substrate comprising an electronic device, the substrate having a first periphery surface and a second periphery surface;
- a sealer disposed to seal the electronic device;
- and
- a conductive blocking film disposed on a surface of the sealer and the first periphery surface the substrate,
- wherein the first periphery surface has a larger perimeter than a perimeter of the second periphery surface.
Dependencies are inferred from the claim text.